Abstract: With the rapid development of aerospace, military, and electronic technologies, packaging methods and packaging materials have become important constraints for electronic devices to further achieve miniaturization, lightweight, and high performance. Phased array radar T/R module packaging materials have experienced from the first generation of Kovar alloy to the second generation of copper-tungsten alloy, and the emergence of the third generation of lightweight materials with aluminum as the matrix in recent years-silicon carbide particle reinforced aluminum matrix composite material and high silicon aluminum alloy, and the problems in the preparation and processing technology of the two have become an important bottleneck restricting the comprehensive promotion and application of the third generation of materials. In this paper, the preparation methods, machining properties, welding processes, and surface treatment of the new generation of packaging materials are reviewed, and the research technology status of the processing and application of the new generation of phased array radar T/R module packaging composites is introduced in detail, and its development trend prospects.