不同热震工况下2.5D编织SiCf/SiC陶瓷基复合材料力学性能及损伤

Mechanical properties and damage of 2.5D braided SiCf/SiC ceramic matrix composites under different thermal shock conditions

  • 摘要: 通过单向拉伸和三点弯曲实验,并结合SEM和EDS分析不同热震工况(次数)下对2.5D编织SiCf/SiC (f表示纤维)陶瓷基复合材料(CMCs)力学性能和损伤的影响。结果表明:2.5D编织SiCf/SiC CMCs在室温无热震和1200℃不同热震工况下的拉伸应力-应变曲线呈现非线性变化,随着热震次数的增加,拉伸强度先逐渐降低,然后小幅度增加,材料在热震10次下的拉伸强度降到48.39%,热震30次后增加到54.11%;材料在室温无热震和1200℃不同热震工况下的三点弯曲位移-载荷曲线也呈现非线性变化,随着热震次数的增加,弯曲强度迅速降低,材料在热震10次下的弯曲强度迅速降到26.06%,热震30次后降到10.77%。从宏观断口分析可知,材料在室温无热震下拉伸、弯曲断口表现为伪脆性断裂特性,而在热震工况下拉伸和弯曲断口则表现出韧性断裂特性。从微观断口观察有纤维拔出、纤维脱粘、界面脱粘、裂纹扩展和纤维断裂等损伤行为,且随着热震次数的增多,界面结合力逐渐减弱,上述等损伤行为均显著增加。

     

    Abstract: The effects of different thermal shock conditions (times) on the mechanical properties and damage of 2.5D braided SiCf/SiC (f represents fiber) ceramic matrix composites (CMCs) were analyzed by uniaxial tensile and three-point bending experiments, combined with SEM and EDS. The results show that the tensile stress-strain curves of 2.5D braided SiCf/SiC CMCs exhibit nonlinear changes at room temperature without thermal shock and under different thermal shock conditions at 1200℃. The tensile strength first decreases gradually, and then increases slightly. The tensile strength of the material decreases to 48.39% under 10 thermal shocks, and increases to 54.11% after 30 thermal shocks; The three-point bending displacement-load curves of the material without thermal shock at room temperature and under different thermal shock conditions at 1200℃ also show nonlinear changes, with the increase of the number of thermal shocks, the flexural strength decreases rapidly, the bending strength of the material rapidly drops to 26.06% under 10 thermal shocks, and decreases to 10.77% after 30 thermal shocks. From the macroscopic fracture analysis, it can be seen that the tensile and bending fractures of the material at room temperature without thermal shock show pseudo-brittle fracture characteristics, while the tensile and bending fractures show ductile fracture characteristics under thermal shock conditions. From the microscopic fracture, damage behaviors such as fiber pullout, fiber debonding, interface debonding, crack propagation and fiber fracture are observed, and with the increase of the number of thermal shocks, the interface bonding force is gradually weakened, and the above-mentioned damage behaviors increase significantly.

     

/

返回文章
返回