低温等离子体表面改性对CFRP胶接性能的影响

Effect of low-temperature plasma surface modification on the adhesive performance of CFRP

  • 摘要: 采用低温等离子体处理技术对碳纤维增强树脂复合材料(CFRP)表面进行处理,以氩气(Ar)、N2和O2作为等离子体激发气体,通过接触角测量仪、AFM、SEM和XPS等测试分析手段,对CFRP表面的润湿性、粗糙度、微观形貌和化学组分进行表征,并结合拉伸剪切试验测试和失效形貌分析,研究了等离子体气体类型、放电功率P和处理时间t对CFRP表面理化特性和胶接性能的影响。结果表明:Ar、N2和O2等离子体处理可以显著改善CFRP胶接性能,当P=800 W,t=20 s时,与未处理相比,CFRP胶接强度分别提高了138%、172%和253%。表面测试分析可知,Ar等离子体处理后,CFRP胶接强度的增加主要是通过提高表面清洁度和增大界面粘接表面积,试样失效模式由界面失效转变为内聚失效为主的混合失效模式。与Ar相比,N2等离子体处理后,CFRP表面生成了较多—NH2极性基团,表面活性增加,进一步提高了CFRP和胶粘剂之间界面的结合力。与以上两种气体相比,O2等离子体刻蚀CFRP表面更为剧烈,并对表层基团进行重组,形成了极性较强—COOH官能团,试样胶接强度提高效果最佳,试样失效模式由界面失效转变为基板失效。此外,当活性粒子的密度和能量过高时,较大的等离子体刻蚀孔隙,在一定程度上会降低胶接性能。

     

    Abstract: Ar, N2 and O2 were used as low-temperature plasma excitation gases to treat the surface of carbon fiber reinforced plastics (CFRP). The effects of plasma gas, discharge power and treatment time on the physicochemical properties, including wettability, roughness, microscopic morphology and chemical components of CFRP surface, were characterized by contact angle measurement, AFM, SEM and XPS. The adhesive joint property was investigated through tensile shear experiment and failure morphology analysis. Compared with untreated, the tensile shear strength of CFRP adhesive joints after Ar, N2 and O2 plasma treatment can significantly improve the bonding performance of CFRP, and when the plasma discharge power is 800 W and treatment time is 20 s, the adhesive joint strength increases by 138%, 172% and 253%, respectively. The surface test analysis shows that the improvement of CFRP adhesive strength after argon plasma treatment is mainly induced by improving the surface cleanliness and increasing the surface area for interfacial adhesive, and the failure modes of samples changes from interfacial failure to mixed failure mode with cohesive failure as the main mode. Compared with Ar, a greater number of polar chemical groups (—NH2) are generated on the CFRP surface after N2 plasma treatment, which increase the surface activity and further improve the interfacial adhesive strength between CFRP and adhesive. Compared with the above two gases, O2 plasma etch the CFRP surface more vigorously, as well as reorganize the surface chemical groups, forming a more polar —COOH functional group, so that the specimen adhesive strength is improved most effectively, and the specimen failure mode changes from interface failure to substrate failure. In addition, under the excessively high density and energy of the active particles, the adhesive performance will be reduced to some extent with the expansion of the pores by plasma etching.

     

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