微热压增材制造轻质、高强度、低导热碳化硅/石墨复合材料

Micro-thermocompression molded light weight, high-strength, low thermal conductivity silicon carbide/graphite composites

  • 摘要: 轻质隔热材料已在飞行器动力装置热防护系统中获得广泛应用,但现有的工艺技术难以实现高承载、轻质、隔热等多个技术目标的协同。基于微热压增材制造成形技术原理快速制备了一种轻质、高强度、低导热碳化硅/石墨复合材料。研究了不同成形密度下复合材料的抗压强度和导热系数变化规律,通过改变材料配方组成(包括热固性酚醛树脂粉末、高纯硅粉和可膨胀石墨质量分数)实现了复合材料的抗压强度和导热系数正反向调节,揭示了其内在机制。研究发现当酚醛树脂粉末、高纯硅粉、可膨胀石墨质量分数分别为30wt%、30wt%、2wt%时,所制备的碳化硅/石墨隔热复合材料兼具低密度(<1.2 g/cm3)、高抗压(>15 MPa)和低导热(<1 W/(m·K))性能,该复合材料在航空航天具有良好的应用前景。

     

    Abstract: Light weight thermal insulation materials have been widely used in the thermal protection system of aircraft power plant, but the existing technology is difficult to achieve the synergy of many technical goals such as high load, light weight and thermal insulation. In this paper, a kind of lightweight, high strength and low thermal conductivity silicon carbide/graphite composite was rapidly prepared based on the principle of micro-hot pressing additive manufacturing and forming technology. The variation law of compressive strength and thermal conductivity of composite materials under different forming densities was studied. By changing the material formula composition (including thermosetting phenolic resin powder, high purity silicon powder and expandable graphite, etc.), the compressive strength and thermal conductivity of composite materials were adjusted forward and backward, and its internal mechanism was revealed. This research finds that when the mass fraction of phenolic resin powder, high purity silicon powder and expandable graphite is 30wt%, 30wt% and 2wt%, respectively, the silicon carbide/graphite thermal insulation composite has the properties of low density (<1.2 g/cm3), high compressive strength (>15 MPa) and low thermal conductivity (< 1 W/(m·K)), which has a good application prospect in aerospace.

     

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