Abstract:
Phenolic epoxy resin (EP) is widely used in electronics because of its excellent electrical insulating pro-perties. The thermal conductivity of EP is low, and filling the highly conductive thermal inorganic fillers is an effec-tive way to construct the thermal conductive pathway of the thermal transport frame to improve the thermal conductivity of polymer composites. In this paper, the hexagonal boron nitride (h-BN)-four needle zinc oxide whisker (T-ZnOw)/EP composite was prepared by solution blended and hot-compaction process. The microstructures aspects, phase structures, thermal conductivity and electric insulating propertis of composites were systematically characterized and analyzed. The results show the h-BN-T-ZnOw/EP composite has good thermal conductivity and electrical insulating properties. When h-BN-T-ZnOw loading is 30wt%/5wt%, the thermal conductivity at 25℃ is 0.55 W/(m·K), which is 2.9 times higher than that of EP, and its volume resistivity is greater than 10
15 Ω·m.