SiC颗粒增强铝基复合材料的纯铜中间层液相扩散焊

Liquid phase diffusion bonding for SiC particles reinforced aluminum matrix composites using pure copper inter-layer

  • 摘要: 采用Cu箔中间层在Ar气氛保护、550℃条件下过渡液相扩散焊(TLP)焊接SiC颗粒(SiCP)增强Al基复合材料SiCP/ZL101和SiCP/Al (SiCP 10vol%),对母材与焊接接头的微观组织、剪切强度、焊接接头剪切断面与断裂路径等进行分析。结果表明:在铸Al(ZL101)与纯Al(Al)基体中,分别通过共晶温度较低的Al-Si-Cu(524℃)三元共晶反应与Al-Cu(548℃)二元共晶反应实现中间层金属/基体金属(M/M)界面润湿。其中铸Al基体焊接接头中虽有颗粒偏聚,但由于Al-Si-Cu三元共晶反应的Cu含量(26.7wt%)低于Al-Cu二元共晶反应的Cu含量(33wt%),SiCP/ZL101焊接接头焊缝中CuAl2相少于SiCP/Al焊接接头焊缝中的CuAl2相,且未出现CuAl2相的聚集,故其强度较高。Cu中间层形成的金属间化合物CuAl2相是影响焊接接头力学性能的重要因素,两种复合材料焊接接头的剪切强度分别为85.4 MPa和73 MPa。

     

    Abstract: The SiC particles (SiCP) reinforced Al composites of SiCP/ZL101 and SiCP/Al with 10vol% of SiCP were welded using Cu inter-layer under argon atmosphere at 550℃ by transient liquid phase diffusion bonding(TLP). The microstructure, shear strength, surface morphology of shear fracture and fracture path of the welded joints were analyzed. The results show that the Cu inter-layer is useful for the wetting of interface between the inter-layer metal and matrix by eutectic reaction of Al-Si-Cu (524℃) and Al-Cu (548℃) at eutectic temperature in the cast Al (ZL101) and pure Al (Al) matrix. Although some particles are gathered in the welded joints of cast Al matrix, the Cu content of the ternary eutectic reaction of Al-Si-Cu is 26.7wt%, which is lower than that of the binary eutectic reaction of Al-Cu (33wt%). Therefore it causes less CuAl2 phase without aggregation in the welded joints of SiCP/ZL101, which results in higher shear strength for the welded joints. While the intermetallic compound of CuAl2 phase remained in the welded joints has an important effect on the mechanical properties of the welded joints. The shear strength of the two composite joints are 85.4 MPa and 73 MPa, respectively.

     

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