机械搅拌器对C-SiC/Cu半固态浆料中石墨颗粒和SiCP的影响

Effect of mechanical stirrer on graphite particles and SiCP in C-SiC/Cu semi-solid slurry

  • 摘要: 利用直桨叶搅拌器在圆柱坩埚内机械搅拌C-SiC/Cu半固态浆料,研究搅拌速度为200 r/min、搅拌器上下移动速度为10 mm/s时C-SiC/Cu半固态浆料中石墨颗粒和SiC颗粒(SiCP)的均匀性。结果表明:直桨叶与水平面的夹角γ与两种颗粒在坩埚顶部和底部含量偏差都存在二次关系,当γ=30°时石墨颗粒和SiCP在坩埚中轴向分布均匀,但同一水平面内的SiCP仍存在偏聚现象,说明SiCP的偏聚是导致常规直桨叶机械搅拌C-SiC/Cu半固态浆料整体不均匀的主要原因;利用双层桨叶搅拌器代替常规直桨叶搅拌器,通过调整叶片层间距h,当h=10~20 mm时可以消除SiCP的偏聚现象;通过对单层桨叶搅拌器和双层桨叶搅拌器机械搅拌铸造获得的C-SiC/Cu复合材料进行磨损试验发现,单层桨叶搅拌器不同部位磨损率存在差异,双层桨叶搅拌器磨损率几乎相同。说明SiCP的偏聚可以通过增大机械搅拌剪切力度得以消除,利用双层桨叶搅拌器进行机械搅拌可以获得均质的C-SiC/Cu半固态浆料。

     

    Abstract: The mechanical stirring of C-SiC/Cu semi-solid slurry was conducted in a cylindrical crucible by a straight-blade stirrer. The distribution of graphite particles and SiC particles (SiCP) in the C-SiC/Cu semi-solid slurry was studied under 200 r/min for stirring speed and 10 mm/s for speed of moving up and down of stirrer. The results show that there is a quadratic relationship between the angle γ between the straight blade and the horizontal plane and the content of the graphite particles and SiCP in the top and bottom of the crucible. When γ=30°, the axial distributions in the crucible of graphite particles and SiCP are homogeneous, but the SiCP are still segregated, which indicates that the segregation of SiCP leads to the unhomogeneity of C-SiC/Cu semi-solid slurry in conventional straight-blade mechanical stirring. The double-blade agitator is used instead of the conventional straight blade agitator to adjust the blade layer spacing h to 10–20 mm, which can eliminate the segregation of SiCP. The wear tests of the C-SiC/Cu composites obtained by mechanical stirring casting with single blade stirrer and double-layer blade stirrer were carried out. The wear rates of different parts of C-SiC/Cu composites in the single blade mechanical stirring casting are different, however, they are nearly the same in the double-layer blade. It shows that the segregation of SiCP can be eliminated by increasing the mechanical agitation shearing action. The uniform distribution of C-SiC/Cu semi-solid slurry can be achieved by double-layer-stirrer mechanical stirring.

     

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