双马来酰亚胺工艺改性及性能

Process modification and properties analysis of bismaleimide

  • 摘要: 采用脂肪族双马来酰亚胺(HMDA-BMI)对4,4’-二苯甲烷型双马来酰亚胺(BDM)进行工艺改性,得到了一种低黏度、流动性好的基体树脂。当HMDA-BMI与BDM的摩尔比为1: 1时,黏度-温度曲线表明改性体系黏度可降低至0.50 Pa·s左右,低黏度平台的温度区间为85~175℃之间;黏度-时间曲线表明改性体系合适的充模温度为130~145℃,获得的改性基体树脂适合RTM成型工艺;通过DSC曲线确定了改性基体树脂固化工艺为160℃×2 h+180℃×2 h+200℃×2 h+230℃×4 h;FTIR表明改性体系按照此工艺可以固化完全;DMA曲线和TG曲线分析结果表明改性体系的耐热性基本保持不变;共聚改性体系的拉伸强度和弯曲强度分别为80.1 MPa和116 MPa。

     

    Abstract: Aliphatic bismaleimide(HMDA-BMI) was used to copolymerize with 4,4’-bismaleimide diphenylmethyene (BDM) for preparing a matrix resin with low viscosity and good processing. When the molar ratio of HMDA-BMI to BDM is 1: 1, the viscosity-temperature test result shows that the viscosity of the HMDA-BMI-BDM system can be reduced to about 0.5 Pa·s, and the temperature range of the low viscosity platform is between 85-175℃. The viscosity-time result shows that the suitable mold filling temperature of the modified system is 130-145℃, and the obtained modified matrix HMDA-BMI-BDM resin is suitable for RTM. The curing process determined by the DSC method is 160℃×2 h+180℃×2 h+200℃×2 h+230℃×4 h. FTIR result shows that the modified system can be completely cured according to this process.The results of DMA and TG analysis show that the heat resistance of the modified system remains basically unchanged. The tensile strength and flexural strength of the modified system reaches 80.1 MPa and 116 MPa, respectively.

     

/

返回文章
返回