Abstract: Epoxy resin is widely used as electronic packaging material with many excellent performances, however, the internal stress of epoxy resin induced in the curing process will bring about unfavorable influence on packaged products. Many experiments were carried out to research the performance parameters of epoxy resin used to electronic packaging, such as curing kinetics, density, thermal conductivity, glass transition temperature, elastic modulus, chemical shrinkage strain, thermal strain, etc. After that, mathematic models of these parameters in the curing process were established. Three-dimensional finite element model was established with ABAQUS to simulate the temperature field, curing degree field, stress and strain field of epoxy resin in the curing process. Sequentially coupled analysis was used to perform heat conduction analysis and stress-strain analysis successively in ABAQUS. The fiber Bragg grating(FBG) experiment was carried out to monitor the evolution of temperature and strain in epoxy resin during the curing process. Comparison of the results between experiment and simulation demonstrates that the finite element model established in this paper is of high reliability.