Preparation of decanoic acid-palmitic acid@modified SiO2 temperature and humidity control composites with ultrasonic wave-assisted
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摘要: 以硅烷偶联剂改性SiO2为壁材,癸酸(DA)-棕榈酸(PA)为芯材,利用超声波辅助溶胶-凝胶法制备DA-PA@改性SiO2调温调湿复合材料,分析了硅烷偶联剂用量、超声波功率、超声波时间和超声波温度对DA-PA@改性SiO2调温调湿复合材料粒径的影响,以及相关性能。结果表明,利用超声波辅助溶胶-凝胶法制备DA-PA@改性SiO2调温调湿复合材料,可以显著降低粒径尺寸和减小粒径分布。当硅烷偶联剂用量为4.0 g、超声波功率为120 W、超声波时间为100 min和超声波温度为60℃时,DA-PA@改性SiO2调温调湿复合材料的粒径较小且粒径分布较窄,即d90=87.36 nm、d50=63.34 nm、d10=44.02 nm和d90-d10=43.34 nm,在相对湿度40.0%~65.0%范围内的平衡含湿量为0.1864~0.2379 g/g,相变温度为20.23~23.59℃,相变潜热为40.91~46.72 J/g,稳定性能良好。
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关键词:
- 调温调湿复合材料 /
- 改性SiO2 /
- 癸酸-棕榈酸(DA-PA) /
- 超声波 /
- 粒径
Abstract: With silane coupling agent modified SiO2 as wall material and decanoic acid (DA)-palmitic acid (PA) as call material, the DA-PA@modified SiO2 temperature and humidity control composites were prepared by sol-gel method with ultrasonic wave-assisted. The effects of the content of silane coupling agent, ultrasonic wave power, ultrasonic wave time and ultrasonic wave temperature on the particle size of the DA-PA@modified SiO2 temperature and humidity control composites and related properties were investigated. The results show that the particle size and its distribution of the DA-PA@modified SiO2 temperature and humidity control composites can be significantly reduced using sol-gel method with ultrasonic wave-assisted. With the content of silane coupling agent of 4.0 g, ultrasonic wave power of 120 W, ultrasonic wave time of 100 min and ultrasonic wave temperature of 60℃, the DA-PA@modified SiO2 temperature and humidity control composites has small diameter and narrow particle size distribution, such as d90=87.36 nm, d50=63.34 nm, d10=44.02 nm and d90-d10=43.34 nm. Its equilibrium moisture content in the relative humidity of 40.0%-65.0% is 0.1864-0.2379 g/g, phase change temperature is 20.23-23.59℃, phase change latent heat is 40.91-46.72 J/g, and the stability performance is good. -
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期刊类型引用(2)
1. 侯普民,毛维,邢哲理,李超峰,李娟. 复合温湿调控材料的制备及湿缓冲特性研究. 新型建筑材料. 2021(06): 166-168 . 百度学术
2. 郑旭,袁丽婷. 复合调湿材料的研究现状及最新进展. 化工进展. 2020(04): 1378-1388 . 百度学术
其他类型引用(1)
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