Abstract: The (SiC_P/Cu)-copper foil laminated composite materials were fabricated by dip coating and hot pressed sintering. The effects of SiC_P content on the microstructure, tensil strength and fracture toughness of the (SiC_P/Cu)-copper foil laminated composites were studied. The results show that the layer thickness of the (SiC_P/Cu)-copper foil laminated composites is homogeneous, the interface bonding is in good condition, and the reinforced phase SiC disperses in the binding phase and interface. With the addition of SiC_P, the tensile strength and yield strength firstly increase, and then decrease. When the volume fraction of SiC_P is 20vol% (the total content is 100), the tensile strength and yield strength reach the maximum value of 226.5 MPa and 113.1 MPa, respectively. The fractural surface of the specimen after tensile strength test exhibits a ductile fracture mode in conjunction with some cleavage fracture features. The fracture toughness which the crack grow parallel to the layer interface has a little decrease with the increase of SiC_P content, the (SiC_P/Cu)-copper foil laminated composites with 15vol% SiC_P content has maximum fracture toughness of 16.96 MPa·m^1/2. When the crack grow perpendicular to the layer interface, the fracture toughness of the samples is also decreased with the increase of SiC_P content, the (SiC_P/Cu)-copper foil laminated composites with 15vol% SiC_P reaches maximum fracture toughness of 12.51 MPa·m^1/2.