Abstract: The demands of polymer-based composites with high thermal conductivity and low filler loading are significant in many applications such as electronic packaging and high-power electronic equipment. In general, the enhanced thermal conductivity requires dispersed filler with high loading in polymer matrix. However, the large amount of fillers usually results in the large degradation of mechanical property and high cost, which will lead to the composites difficult to meet the demands of present industrial applications. In this review, the current research progress on polymer-based composites with high thermal conductivity and low loading was discussed. Its thermal conduction mechanism and some factors, which primarily affected the thermal conductivity of composites, were recommended. And some methods that were used in preparing polymer-based composites with a thermal conductivity over 1.0 W/(m·K) and a low filler loading below 10vol%, were introduced according to different filler type. The challenges and outlook for polymer-based composites with high thermal conductivity and low filler loading were outlined.