Abstract: Using a novel imidazole derivative EGE-2MI as latent accelerant for dicyandiamide-epoxy resin system, the curing behavior and the storage life of the system were investigated. The kinetics of curing reaction of the resin system were studied by DSC method, and optimum curing process parameters were determined. The storage life of the dicyandiamide-epoxy resin system at room temperature was evaluated by using DSC to measure the variation of the enthalpy at different storage time in ambient environment. And mechanical properties of the moderate-temperature curing products were also tested and analyzed. The results reveal that the dicyandiamide-epoxy resin systems with 0.6%-1.8% EGE-2MI content (content of epoxy resin as 100%) can be effectively cured at 115-125℃, the curing reaction activation energy of the resin system with 1.8% EGE-2MI content is 87.23 kJ/mol. The resin system is also chemically stable at room temperature, and has a storage life for over 35 days. Al-Al shear strength of cured system can reach 21.3 MPa, and its tensile strength is over 40 MPa.