SiC颗粒-SiC晶须混杂填料/双马来酰亚胺树脂导热复合材料的制备与性能

党婧; 刘婷婷

doi:10.13801/j.cnki.fhclxb.20160328.002

SiC颗粒-SiC晶须混杂填料/双马来酰亚胺树脂导热复合材料的制备与性能

党婧^1,,
刘婷婷²

1.
中航工业第一飞机设计研究院标准工艺材料研究所, 陕西阎良 710089;
2.
第二炮兵指挥学院, 武汉 430012

基金项目: 国家自然科学基金（51403175）

详细信息

通讯作者:
党婧,博士,工程师,研究方向为树脂基复合材料制备和改性研究。E-mail:dangjing1985@163.com

中图分类号: TQ327.8
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出版历程
- 收稿日期: 2016-02-21
- 修回日期: 2016-03-10
- 刊出日期: 2017-02-14

Preparation and properties of SiC_P-SiC_W hybrid fillers/bismaleimide thermal conductivity composites

DANG Jing^1,,
LIU Tingting²

1.
Standard Process Material Research Institute, AVIC the First Aircraft Institute, Shaanxi Yanliang, 710089, China;
2.
The Second Artillery Command College, Wuhan, 430012, China

摘要

摘要: 以双马来酰亚胺树脂（BMI）为树脂基体，二烯丙基双酚A（DABA）为增韧剂，γ-缩水甘油醚氧丙基三甲氧基硅烷（KH-560）表面改性的SiC颗粒-SiC晶须（SiC_P-SiC_W）为复配导热填料，浇注成型制备SiC_P-SiC_W/BMI导热复合材料，分析研究SiC形状、用量、质量比及表面改性对SiC_P-SiC_W/BMI导热复合材料的导热性能、介电性能、力学性能和热性能的影响。结果表明，当改性SiC_P-SiC_W用量为40wt%且SiC_P∶SiC_W质量比为1∶3时，SiC_P-SiC_W/BMI导热复合材料具有最佳的综合性能，导热系数λ为1.125 W（m·K）^-1，介电常数ε为4.12，5%热失重温度为427℃。
- 双马来酰亚胺树脂 /
- 二烯丙基双酚A /
- SiC颗粒 /
- SiC晶须 /
- 导热复合材料
Abstract: Functionalized SiC particle-SiC whisker (SiC_P-SiC_W) hybrid fillers by γ-glycidoxypropyltrimethoxysilane (KH-560) were performed to fabricate the functionalized SiC_P-SiC_W/bismaleimide (SiC_P-SiC_W/BMI) thermal conductivity composites,BMI as the polymeric matrix and diallylbisphenol A (DABA) as a toughening agent,respectively.Effects of the shape,content,compound and surface functionalization of SiC fillers on the thermal conductivities,dielectric & mechanical properties and thermal stabilities of the functionalized SiC_P-SiC_W/BMI thermal conductivity composites were investigated.The results show that the functionalized SiC_P-SiC_W/BMI thermal conductivity composite with 40wt% functionalized SiC_P-SiC_W(1:3,mass ratio) hybrid fillers exhibits the best comprehensive performance,the corresponding thermally conductive coefficient λ of 1.125 W (m·K)^-1,dielectric constant ε of 4.12,and 5wt% thermal mass loss temperature of 427℃.
- bismaleimide /
- diallylbisphenol A /
- SiC_P /
- SiC_W /
- thermal conductivity composites

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