Citation: | DING Anxin, YU Xingchen, YANG Peng, et al. Characterization and simulation on the cure behavior of epoxy resin for encapsulation structure[J]. Acta Materiae Compositae Sinica, 2022, 39(4): 1824-1833. doi: 10.13801/j.cnki.fhclxb.20210726.004 |
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