基于多功能插层结构的高导热碳纤维复合材料制备与表征

曹洪涛; 程涛; 孙征昊; 陈立; 李瑶瑶; 胡秉晟

基于多功能插层结构的高导热碳纤维复合材料制备与表征

上海卫星装备研究所, 上海 200240

基金项目: 上海市青年科技英才扬帆计划 (22YF1446900)；国家自然科学基金青年科学基金(12002214)

详细信息

通讯作者:
曹洪涛，硕士研究生，工程师，研究方向为多尺度增强碳纤维复合材料及其界面性能研究　E-mail: caoht0811@126.com

中图分类号: TB333
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- HTML全文浏览量: 37
- 被引次数: 0
出版历程
- 收稿日期: 2023-10-17
- 修回日期: 2024-01-14
- 录用日期: 2024-01-29
- 网络出版日期: 2024-03-15

Preparation and characterization on carbon fiber composites with high thermal conductivity based on multifunctional intercalation structures

Shanghai Institute of Spacecraft Equipment, Shanghai 200240

Funds: Shanghai Sailing Program (22YF1446900); National Natural Science Foundation Youth Science Foundation (12002214)

摘要

摘要: 随着碳纤维增强树脂基复合材料在航天领域中的广泛应用，结构/功能一体化碳纤维(CF)复合材料将发挥出重要作用。本文采用功能化层间技术(Functional Interlayer Technology，FIT)制备了高导热沥青基碳纤维增强氰酸酯复合材料。在短切碳纤维薄膜表面电泳沉积石墨烯片(GNPs)和Al₂O₃制备薄膜材料GNPs-Al₂O₃/CF作为多功能插层结构，以其取代纤维层之间的富树脂层区域。后者表现出良好的导热性能，正交铺层复合材料的面内热导率和面外热导率分别提高了123.1%和77.5%，准各向同性铺层复合材料的面内热导率和面外热导率分别提高了119.0%和50.0%。此外，多功能插层结构的加入可以阻碍裂纹的扩展，改善复合材料层间韧性。因此，多功能插层结构既能在层间形成有效的导热网络结构改善复合材料面内和面外热导率，又能提高层间区域的增韧效率。
- 功能化层间技术 /
- 碳纤维复合材料 /
- 面内热导率 /
- 面外热导率 /
- 层间增韧
Abstract: With the extensive application of carbon fiber reinforced resin matrix composites in aerospace field, structure/function integrated composites will play a crucial part. In this paper, asphalt based carbon fiber (CF) reinforced cyanate ester composites with high thermal conductivity were prepared by functional interlayer technology (Functional Interlayer Technology, FIT). The film material graphene sheets (GNPs)-Al₂O₃/CF prepared by electrophoretic deposition of GNPs and Al₂O₃ on the surface of the short-cut carbon fiber film was used as the functional interlayer film to replace the resin-rich layer region between the fiber layers. The in-plane thermal conductivity and through-plane thermal conductivity of orthogonal lamination composites are increased by 123.1% and 77.5%. The in-plane thermal conductivity and through-plane thermal conductivity of quasi-anisotropic lamination composites are increased by 119.0% and 50.0%, respectively. In addition, the addition of multifunctional intercalation structure can prevent the propagation of cracks and improve the interlaminar toughness of composites. Therefore, the multifunctional intercalation structure can not only form an effective thermal network structure between the layers to improve the in-plane and out-of-plane thermal conductivity of the composite, but also improve the toughening efficiency of the interlayer region.
- Functional interlayer technology /
- Carbon fiber composites /
- In-plane thermal conductivity /
- Through-plane thermal conductivity /
- Interlayer toughening

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图 1 薄膜制备技术路线图

Figure 1. Roadmap of thin film preparation technology

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图 2 复合材料导热性能测试试样制备示意图

Figure 2. Schematic diagram of sample preparation for thermal conductivity testing of composite materials

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图 3 复合材料层间增韧测试试样制备示意图

Figure 3. Schematic diagram of sample preparation for interlayer toughening test of composite materials

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图 4 FIT_in、FIT_OUT和FIT_lft复合材料层合板试样热压罐固化成型和固化工艺示意图

Figure 4. Schematic diagram of the curing process of FIT_in, FIT_OUT and FIT_lft composite laminates in a hot pressing tank

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图 5 基于SEM的TC-HC-600碳纤维表面微观形貌

Figure 5. Surface Micromorphology of TC-HC-600 Carbon Fibers Based on SEM

(a) Surface contains a sizing agent; (b) Surface does not contain sizing agent; (c) Surface electrodeposition modification

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图 6 基于AFM的TC-HC-600碳纤维表面微观形貌

Figure 6. Surface Micromorphology of TC-HC-600 Carbon Fibers Based on AFM

(a) Surface contains a sizing agent; (b) Surface does not contain sizing agent; (c) Surface electrodeposition modification

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图 7 CF与GNPs-Al₂O₃/CF薄膜的表面接触角示意图

Figure 7. CF and GNPs-Al₂O₃/CF schematic diagram of surface contact angle of thin film

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图 8 不同薄膜材料的面内(a)和面外(b)热导率

Figure 8. In plane (a) and out of plane (b) thermal conductivity of different thin film materials

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图 9 不同薄膜结构热传输路径示意图：(a)Al₂O₃热传输路径；(b)GNPs热传输路径；(c)GNPs-Al₂O₃热传输路径；(d)基于SEM的GNPs-Al₂O₃微观结构示意图

Figure 9. Schematic diagram of heat transfer paths for different thin film structures: (a) Heat transfer paths of Al₂O₃, (b) Hert transfer paths of GNPs, (c)Heat transfer paths of GNPs-Al₂O₃, (d) Microstructure diagram of GNPs-Al₂O₃ based on SEM

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图 10 正交铺层(a)和准各向同性铺层(b)复合材料层合板的热导和热扩散系系数(c)

Figure 10. Thermal conductivit and thermal diffusion coefficient (c) of composite laminates with orthogonality (a) and quasi-isotropy (b) ply structures

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图 11 FIT_lft试样I型层间断裂能

Figure 11. Type I interlayer fracture energy of sample FIT_lft

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图 12 空白组FIT_lft试样典型的力—位移曲线(a)和R曲线(b)

Figure 12. Typical force displacement curves (a) and R curves (b) for blank and ssample FIT_lft

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表 1 用于对比实验的薄膜材料

Table 1. Thin film materials for comparative experiments

Sample	Sizing agent	Electrophoretic deposition
CF	Yes	None
CF-1	None	None
Al₂O₃/CF	None	Al₂O₃
GNPs/CF	None	GNPs
GNPs-Al₂O₃/CF	None	GNPs/ Al₂O₃
Notes: CF—Carbon fiber; GNPs—Graphene sheets.

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