Threshold properties of high modulus carbon fiber reinforced plastic composite with picosecond laser processing
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摘要: 对聚丙烯腈基高模量碳纤维/改性氰酸酯树脂复合材料(M55/BS-4)和一种沥青基高导热碳纤维/树脂基复合材料(K600/5418)的皮秒激光加工阈值和形貌特性进行了研究。通过面积外延法测定并比较了这两种碳纤维复合材料的近红外皮秒激光加工阈值及其阈值孵化效应,并预测了两种复合材料的单脉冲阈值;分析了入射能量通量(0.7~25 J/cm2)及光束扫描速度(0.2~5 m/s)对切口质量的影响规律。结果表明,碳纤维热导率的巨大差异导致不同碳纤维复合材料的加工阈值及形貌存在明显定量差距。使用可获得的最高扫描速度(5 m/s)和3.2倍(~8 J/cm2)单脉冲阈值的加工参数,可使材料的碳纤维和树脂几乎协同去除,加工形貌上表现为切缝入口宽度均匀、切割边缘整齐。使用更高扫描速度并配以合适的加工能量有望进一步提高加工质量。Abstract: The picosecond laser processing thresholds and morphology characteristics of polyacrylonitrile-based high modulus carbon fiber reinforced cyanate ester composite (M55/BS-4) and an asphalt-based high thermal conductivity carbon fiber reinforced plastic (K600/5418) were studied. Diameter-regression method was used to test and compare the ablation threshold, threshold incubation effect, and single-pulse thresholds for each composite were predicted. The influence of incident energy fluence (0.7-25 J/cm2) and beam scanning velocity (0.2-5 m/s) on the incision quality was analyzed. The results show that the great difference in the fiber thermal conductivity leads to significant quantitative difference in processing threshold and morphology. Using the highest scanning speed (5 m/s) available and fluence equivalent to 3.2 times the single-pulse threshold (i.e., about 8 J/cm2), carbon fiber and resin can be almost synergically removed, characterized by uniform slit inlet widths and neat cutting edge. The use of higher scanning speeds coupled with appropriate processing energy is expected to further improve the quality of processing.
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Key words:
- high modulus /
- carbon fiber /
- plasticsmatrix /
- picosecond laser /
- ablation threshold /
- incubation effect
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表 1 高模量碳纤维增强树脂基(CFRP)复合材料参数
Table 1. Parameters of high-modulus carbon fiberreinforced plastic composite (CFRP) composites
M55/BS-4 K600/5418 Layer way Single direction Single direction Layer direction [0]10 [0]10 Thickness/mm 1 1 Mass percent of fiber 66% 68% Density/(kg·m−3) 1.7 1.8 Thermal conductivity /(W·m−1·K−1) 131.2 377.3 表 2 激光器与共性加工参数
Table 2. Laser and processing parameters
Parameter Value Average power P/W 1 -50 Repetition frequency f / kHz 1 -1 000 Scanning speed vs / (m·s−1) 0.02-5 Scanning pass n 50 Pulse duration $ \tau $(1/2 light intensity)/ps 10 Wavelength $ \lambda $/nm 1064 表 3 M55/BS-4在不同激光扫描速度下的实际光斑直径与烧蚀阈值通量
Table 3. Actual spot diameters and ablative threshold fluence of M55/BS-4 at different laser scanning speeds
Speed/(m·s−1) Spot diameter d/μm Threshold fluence/(J·cm−2) 0.8 23.86±0.56 1.13±0.29 1.5 23.01±0.35 1.21±0.22 3.0 23.51±0.16 1.32±0.11 5.0 25.55±0.23 1.65±0.21 表 4 K600/5418在不同激光扫描速度下的实际光斑直径与烧蚀阈值通量
Table 4. Actual spot diameters and ablative threshold fluence of K600/5418 at different laser scanning speeds
Speed/(m·s−1) Spot diameter d/μm Threshold fluence/(J·cm−2) 0.8 23.11±0.48 0.78±0.19 1.5 24.56±0.27 1.30±0.16 3.0 25.27±0.20 1.61±0.16 5.0 25.14±0.20 1.87±0.21 表 5 M55/BS-4与K600/5418的孵化系数S与单脉冲阈值通量Fth(1)
Table 5. Incubation coefficient S and single-pulse threshold fluence Fth(1) of M55/BS-4 and K600/5418
M55/BS-4 K600/5418 S 0.65±0.06 0.87±0.07 Fth(1) /(J·cm−2) 2.44±0.88 2.68±0.67 -
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