不同热震工况下2.5D编织SiC<sub>f</sub>/SiC陶瓷基复合材料力学性能及损伤

段宏宇; 王贺权; 张佳平; 郑伟; 陈婧

doi:10.13801/j.cnki.fhclxb.20221011.002

不同热震工况下2.5D编织SiC_f/SiC陶瓷基复合材料力学性能及损伤

doi: 10.13801/j.cnki.fhclxb.20221011.002

1.
沈阳航空航天大学　机电工程学院，沈阳 110136
2.
中国航发沈阳黎明航空发动机有限责任公司，沈阳 110043

基金项目: 辽宁省航发材料摩擦学重点实验室开放课题(LKLAMTF202204)

详细信息

通讯作者:
王贺权，博士，教授，硕士生导师，研究方向为真空装备与涂层技术　E-mail：neuwhq@163.com

中图分类号: TB332
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出版历程
- 收稿日期: 2022-08-15
- 修回日期: 2022-09-14
- 录用日期: 2022-09-30
- 网络出版日期: 2022-10-12
- 刊出日期: 2023-07-15

Mechanical properties and damage of 2.5D braided SiC_f/SiC ceramic matrix composites under different thermal shock conditions

1.
School of Mechanical and Electrical Engineering, Shenyang University of Aeronautics and Astronautics, Shenyang 110136, China
2.
AECC Shenyang Liming Aero Engine CO., LTD., Shenyang 110043, China

Funds: Open Project of Liaoning Key Laboratory of Aero-engine Materials Tribology (LKLAMTF202204)

摘要

摘要: 通过单向拉伸和三点弯曲实验，并结合SEM和EDS分析不同热震工况(次数)下对2.5D编织SiC_f/SiC (f表示纤维)陶瓷基复合材料(CMCs)力学性能和损伤的影响。结果表明：2.5D编织SiC_f/SiC CMCs在室温无热震和1200℃不同热震工况下的拉伸应力-应变曲线呈现非线性变化，随着热震次数的增加，拉伸强度先逐渐降低，然后小幅度增加，材料在热震10次下的拉伸强度降到48.39%，热震30次后增加到54.11%；材料在室温无热震和1200℃不同热震工况下的三点弯曲位移-载荷曲线也呈现非线性变化，随着热震次数的增加，弯曲强度迅速降低，材料在热震10次下的弯曲强度迅速降到26.06%，热震30次后降到10.77%。从宏观断口分析可知，材料在室温无热震下拉伸、弯曲断口表现为伪脆性断裂特性，而在热震工况下拉伸和弯曲断口则表现出韧性断裂特性。从微观断口观察有纤维拔出、纤维脱粘、界面脱粘、裂纹扩展和纤维断裂等损伤行为，且随着热震次数的增多，界面结合力逐渐减弱，上述等损伤行为均显著增加。
- 2.5D编织物 /
- SiC_f/SiC复合材料 /
- 陶瓷基 /
- 热震 /
- 力学性能 /
- 损伤
Abstract: The effects of different thermal shock conditions (times) on the mechanical properties and damage of 2.5D braided SiC_f/SiC (f represents fiber) ceramic matrix composites (CMCs) were analyzed by uniaxial tensile and three-point bending experiments, combined with SEM and EDS. The results show that the tensile stress-strain curves of 2.5D braided SiC_f/SiC CMCs exhibit nonlinear changes at room temperature without thermal shock and under different thermal shock conditions at 1200℃. The tensile strength first decreases gradually, and then increases slightly. The tensile strength of the material decreases to 48.39% under 10 thermal shocks, and increases to 54.11% after 30 thermal shocks; The three-point bending displacement-load curves of the material without thermal shock at room temperature and under different thermal shock conditions at 1200℃ also show nonlinear changes, with the increase of the number of thermal shocks, the flexural strength decreases rapidly, the bending strength of the material rapidly drops to 26.06% under 10 thermal shocks, and decreases to 10.77% after 30 thermal shocks. From the macroscopic fracture analysis, it can be seen that the tensile and bending fractures of the material at room temperature without thermal shock show pseudo-brittle fracture characteristics, while the tensile and bending fractures show ductile fracture characteristics under thermal shock conditions. From the microscopic fracture, damage behaviors such as fiber pullout, fiber debonding, interface debonding, crack propagation and fiber fracture are observed, and with the increase of the number of thermal shocks, the interface bonding force is gradually weakened, and the above-mentioned damage behaviors increase significantly.
- 2.5D braid /
- SiC_f/SiC composite /
- ceramic matrix /
- thermal shock /
- mechanical properties /
- damage

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图 1 热震实验设备及示意图

Figure 1. Thermal shock experimental equipment and schematic diagram

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图 2 2.5D SiC_f/SiC (f 表示纤维)陶瓷基复合材料(CMCs)单向拉伸应力-应变曲线

Figure 2. Uniaxial tensile stress-strain curve of 2.5D SiC_f/SiC (f represents fiber) ceramic matrix composites (CMCs)

F—Force

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图 3 2.5D编织SiC_f/SiC CMCs单向拉伸断口局部SEM形貌图及示意图

Figure 3. Local SEM images and schematic diagram of uniaxial tensile fracture of 2.5D braided SiC_f/SiC CMCs

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图 4 2.5D编织SiC_f/SiC CMCs单向拉伸宏观断口形貌

Figure 4. Macroscopic fracture morphologies of 2.5D braided SiC_f/SiC CMCs under uniaxial tension

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图 5 2.5D SiC_f/SiC CMCs三点弯曲位移-载荷曲线

Figure 5. Three-point bending displacement-load curves of 2.5D SiC_f/SiC CMCs

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图 6 2.5D编织SiC_f/SiC CMCs 1200℃热震10次三点弯曲断口局部SEM图像

Figure 6. Local SEM image of 2.5D braided SiC_f/SiC CMCs with 10 thermal shocks at 1200℃ and three-point bending fracture

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图 7 2.5D编织SiC_f/SiC CMCs三点弯曲宏观断口形貌

Figure 7. Three-point bending macroscopic fracture morphologies of 2.5D braided SiC_f/SiC CMCs

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图 8 2.5D编织SiC_f/SiC CMCs三点弯曲断口整体SEM图像

Figure 8. Overall SEM images of three-point bending fracture of 2.5D braided SiC_f/SiC CMCs

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图 9 2.5D SiC_f/SiC CMCs不同热震次数的拉伸和弯曲强度保持率曲线

Figure 9. Tensile and flexural strength retention curves of 2.5D SiC_f/SiC CMCs with different thermal shock times

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表 1 2.5D SiC_f/SiC CMCs单向拉伸断口纤维表面EDS元素分析

Table 1. Uniaxial tensile fracture fiber surface EDS element analysis of 2.5D SiC_f/SiC CMCs

Working condition	$ \omega $/%
Working condition	Si	O
No thermal shock at room temperature	83.03	0
1200℃ thermal shock 10 times	67.57	10.59
1200℃ thermal shock 30 times	75.76	2.03
Note: $ \omega $—Percentage of the element content in the total element content.

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表 2 2.5D SiC_f/SiC CMCs三点弯曲断口纤维表面EDS元素分析

Table 2. Three-point bending fracture fiber surface EDS element analysis of 2.5D SiC_f/SiC CMCs

Working condition	$ \omega $/%
Working condition	Si	O
No thermal shock at room temperature	85.01	0
1200℃ thermal shock 10 times	67.80	17.40
1200℃ thermal shock 20 times	61.58	23.05
1200℃ thermal shock 30 times	74.52	16.62

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