树脂基复合材料制件微波固化数值模拟

龙习坤; 李树健; 陈蓉; 曹正; 李常平; 常腾飞

doi:10.13801/j.cnki.fhclxb.20220419.009

树脂基复合材料制件微波固化数值模拟

doi: 10.13801/j.cnki.fhclxb.20220419.009

1.
湖南科技大学　机电工程学院，湘潭 411201
2.
湖南工程学院　机械工程学院，湘潭 411104

基金项目: 国家自然科学基金(51975208)；湖南省自然科学基金(2020 JJ4301)

详细信息

通讯作者:
李树健，博士，副教授，硕士生导师，研究方向为树脂基复合材料成型与切削加工技术　E-mail: smart0110@126.com

中图分类号: TQ327.3
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出版历程
- 收稿日期: 2022-03-15
- 修回日期: 2022-03-28
- 录用日期: 2022-04-10
- 网络出版日期: 2022-04-20
- 刊出日期: 2023-04-15

Numerical simulation of microwave curing of resin matrix composites workpiece

1.
School of Mechanical Engineering, Hunan University of Science and Technology, Xiangtan 411201, China
2.
School of Mechanical Engineering, Hunan Institute of Engineering, Xiangtan 411104, China

Funds: National Natural Science Foundation of China (51975208); Natural Science Foundation of Hunan Province (2020 JJ4301)

摘要

摘要: 以T800碳纤维/X850环氧树脂复合材料T型制件为结合对象，利用COMSOL Multiphysics仿真软件，建立了反映复合材料制件单馈口谐振腔体微波固化的有限元仿真模型，研究了微波腔体和制件内部的电磁场、温度场、固化度场的分布规律及其与微波输入功率的映射关系。结果表明：在微波腔体内和制件内存在相反的电场强度分布，在复合材料制件内，远离微波馈入端口的区域的电场强度要高于近馈入端口区域，且在制件棱角区域，电场强度存在较强的尖端效应；随微波输入功率增加，微波腔体及制件内部的电场强度均随之增加，制件内电场强度最大值出现在上、下表面，且下表面温度明显较上表面高；提高微波输入功率会导致制件升温过快，进而诱发温度及固化度梯度。在升温中后期的制件厚度方向，温度和固化度梯度较明显。本文推荐微波输入功率应控制在500 W以内。
- 树脂基复合材料 /
- 微波固化 /
- 固化温度 /
- 固化度 /
- 数值模拟
Abstract: Taking T800 carbon fiber/X850 epoxy composites T-shaped workpiece as the combined object, using COMSOL Multiphysics simulation software, the finite element simulation model reflecting the microwave curing of single feed resonant cavity of composites workpiece was established, and the distribution laws of electromagnetic field, temperature field and curing degree field inside the microwave cavity and workpiece and their mapping relationship with microwave input power were studied. The results show that there are opposite electric field intensity distributions in the microwave cavity and the workpiece. In the composite workpiece, the electric field intensity in the area far away from the microwave feed port is higher than that near the feed port, and there is a strong tip effect in the angular area of the workpiece; With the increase of microwave input power, the electric field intensity in the microwave cavity and the workpiece increases. The maximum electric field intensity appears on the upper and lower surfaces, and the temperature of the lower surface is significantly higher than that of the upper surface; Increasing the microwave input power will lead to the rapid temperature rise of the workpiece, and then induce the gradient of temperature and curing degree. In the middle and late stage of heating up, the gradient of temperature and curing degree is obvious. This study recommends that the microwave input power should be controlled within 500 W.
- resin matrix composites /
- microwave curing /
- curing temperature /
- curing degree /
- numerical simulation

HTML全文

图 1 T型制件微波固化建模示意图：(a) 仿真几何模型；(b) T型件几何模型及探针布置；(c) 网格质量云图；(d) 特征边界对流示意图

Figure 1. Schematic diagram of microwave curing modeling of T-shaped workpiece: (a) Simulation geometry model; (b) Geometric model and probe arrangement of T-shaped parts; (c) Grid quality cloud chart; (d) Characteristic boundary convection diagram

T800/X850—Carbon fiber/epoxy resin; f—Microwave frequency; P_a—Initial air pressure; SIBC—Impedance boundary condition; H—Boundary feature height; L—Boundary feature length; P_in—Input power

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图 2 微波固化数值模拟流程图

Figure 2. Flow chart of microwave curing numerical simulation

t₁—Curing heating time; t₂—Holding time; t—Total curing time

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图 3 T800/X850复合材料制件电磁场分布云图 (输入功率P_in=200 W)：(a) 谐振腔体电场分布云图；(b) 沿 XZ 平面及 XY 平面剖切的模型域内电磁场分布；(c) 模型域内的磁场分布；(d) 制件内部的电场分布

Figure 3. Cloud diagram of electromagnetic field distribution of T800/X850 composites workpiece (Input power P_in=200 W): (a) Nephogram of electric field distribution in resonant cavity; (b) Electromagnetic field distribution in the model domain cut along the XZ and XY planes; (c) Magnetic field distribution in the model domain; (d) Electric field distribution inside the workpiece

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图 4 T800/X850复合材料制件环境域及其域内的电场强度E

Figure 4. Electric field strength E in environment and in T800/X850 composites workpiece

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图 5 T800/X850复合材料制件域内中轴线的电场强度

Figure 5. Electric field intensity of central axis in T800/X850 composites workpiece

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图 6 T800/X850复合材料的电阻损耗-温度-输入功率关系

Figure 6. Relationship of resistance loss-temperature-input power of T800/X850 composites

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图 7 T800/X850复合材料固化工艺曲线(a)与微波冷、热点分布(b)

Figure 7. Curing curve (a) and distribution of microwave cold and hot spot (b) of T800/X850 composites

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图 8 T800/X850复合材料制件温度场分布云图 (P_in=200 W)

Figure 8. Cloud diagram of temperature field distribution of T800/X850 composites workpiece (P_in=200 W)

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图 9 微波输入功率对T800/X850复合材料升温过程的影响

Figure 9. Effect of microwave input power on temperature rising process of T800/X850 composites

δT_max—Maximum temperature gradient value

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图 10 P_in对T800/X850复合材料制件固化度的影响

Figure 10. Effect of P_in on curing degree of T800/X850 composite workpiece

α_ave—Average curing degree; ∆α_max—Maximum curing degree gradient value; T(t)—Temperature curve; α_A, α_B, α_C, α_D, α_E—Degree of cure at points A, B, C, D, and E

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图 11 T800/X850复合材料温度、固化度仿真与实验结果对比

Figure 11. Comparison between simulation and experimental results of temperature and curing degree of T800/X850 composite

α_exp—Experimental curing degree; T_exp—Experimental Temperture; β—Heating rate

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表 1 T800碳纤维/X850环氧树脂预浸料的材料属性^[16-18]

Table 1. Material properties of T800 carbon fiber/X850 epoxy resin prepregs^[16-18]

Parameter	Value
Relative dielectric constant	65-20j
Relative permeability	1
Conductivity (C_X, C_Y, C_Z)/(s·m⁻¹)	8696.45, 52.3, 52.3
Thermal conductivity in parallel fiber direction/(W·(m·K)⁻¹)	−0.8863+0.0109T+0.2503α−0.3318e⁻⁵T²−0.0286α²
Thermal conductivity in vertical fiber direction/(W·(m·K)⁻¹)	−0.5178+0.0055T+0.0784α−4.5880e⁻⁶T²−0.0663α²
Density/(kg·m⁻³)	1570
Constant pressure heat capacity/(J·(kg·K)⁻¹)	−401.7+5.9T+135.1α−4.8723e⁻³T²
Surface emissivity	1
Fiber volume fraction	0.65
Resin volume fraction	0.35
Notes: j—Imaginary part of the relative dielectric constant; C_X, C_Y and C_Z—Conductivity in different directions; T—Instantaneous temperature of T800/X850 composites; α—Instantaneous curing degree of T800/X850 composites.

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表 2 T800/X850复合材料微波固化工艺数据

Table 2. Microwave curing process data of T800/X850 composites

P_in/W	Maximum curing gradient/%	t/s
200	5.9	3600
500	14.5	2000
1000	21.0	1500
1500	21.5	1200
2000	25.0	1000

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