Curing reaction kinetics on SiO2 contained benzoxazine/bismaleimide composites system
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摘要: 为改善双马来酰亚胺树脂(BMI)脆性过大、耐热性不足的缺点,以末端含有氨基的纳米SiO2(SiO2-NH2)为原料,通过溶剂法制备出结构中含有SiO2的苯并噁嗪树脂单体(SiO2-BOZ),作为改性体系加入到BMI中进行共混,制备出一种耐热性能、韧性良好的新型SiO2-BOZ/BMI树脂材料,并详细研究了SiO2-NH2的添加对BMI固化反应动力学的影响。结果表明,当SiO2-BOZ添加量达到15.0wt%时,SiO2-BOZ/BMI树脂复合材料的表观活化能较纯BMI树脂得到了一定程度的降低,SiO2-BOZ/BMI的弯曲强度达到最大值166.12 MPa,较纯BMI 增加了32.3%,且具有比BMI更好的耐热性能。Abstract: To overcome the excessive brittleness and lower thermal resistant of bismaleimide resins, the silicon dioxide with amino terminal groups (SiO2-NH2) was chosen as raw materials to prepare benzoxazine monomer containing SiO2 (SiO2-BOZ). The SiO2-BOZ was then used as the modified system to modify bismaleimide (BMI), aiming to obtain a kind of new SiO2-BOZ/BMI composites with better processability and heat-resistant properties, while the influence of addition of SiO2-BOZ on curing reaction kinetics of BMI was also studied. The results show that when the content of SiO2-BOZ reaches 15.0wt%, the apparent activation energy of SiO2-BOZ/BMI resin is reduced to a certain extent compared with that of pure BMI resin, and the bending strength of SiO2-BOZ/BMI reaches a maximum of 166.12 MPa, which is 32.3% higher than that of pure BMI, the SiO2-BOZ/BMI also possesses better heat resistance than that of BMI.
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Key words:
- bismaleimide /
- benzoxazine /
- curing reaction kinetics /
- mechanical properties /
- thermal resistant
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表 1 不同升温速率下BMI的DSC固化曲线上放热峰的峰值温度
Table 1. Peak temperature on DSC curves of BMI at different temperature increasing rates
Heating rate/(℃·min−1) 5 10 15 Ti/℃ 175.74 203.76 212.85 Tm/℃ 250.67 270.33 280.07 Tf/℃ 294.82 310.89 345.27 Notes: Ti—Temperature of onset; Tm—Temperature of peak; Tf—Temperature of ending. 表 2 不同升温速率下SiO2-BOZ/BMI的DSC固化曲线上放热峰的峰值温度
Table 2. Peak temperature on DSC curves of SiO2-BOZ/BMI at different temperature increasing rates
Heating rate/(℃·min−1) 5 10 15 Ti/℃ 197.96 207.47 210.93 Tm/℃ 238.65 258.59 271.99 Tf/℃ 291.89 306.28 311.38 -
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