Abstract: The dynamic mechanical analysis (DMA) for hollow for glass microsphere(HGM)/epoxy resin composite was conducted. The temperature-dependent mechanical properties were given for HGM/epoxy resin composite. The storage and loss moduli master curves for HGM/epoxy resin composite were presented through application of the time-temperature superposition on measurements at a series of temperatures. The influence of temperature, frequency, volume ratio and particle size on the storage and loss modalus was analyzed, and the influence mechanism was investigated by SEM for HGM/epoxy resin composite. It is found that the storage and loss moduli of the composite both increase as the HGM volume fraction is increased. The storage modulus decreases with the increasing temperature, the loss modulus initially increases significantly with temperature and then decreases, forming a peak near the glass transition temperature for HGM/epoxy resin composite. Ratio of less than 10% is good to improve its dynamic mechanical properties. The agglomeration of particles and the adhesion of the interface have great influence on the dynamic mechanical properties of HGM/epoxy resin composites.