用热弯实验方法决定导电薄膜的热膨胀系数

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用热弯实验方法决定导电薄膜的热膨胀系数

沈为, 彭立华, 李伟, 邓泽贤

文章导航 > 复合材料学报 > 2001 > 18(2): 90-93

沈为, 彭立华, 李伟, 等. 用热弯实验方法决定导电薄膜的热膨胀系数[J]. 复合材料学报, 2001, 18(2): 90-93.

引用本文:

沈为, 彭立华, 李伟, 等. 用热弯实验方法决定导电薄膜的热膨胀系数[J]. 复合材料学报, 2001, 18(2): 90-93.

SHEN Wei, PENG Li-hua, LI Wei, et al. DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST[J]. Acta Materiae Compositae Sinica, 2001, 18(2): 90-93.

Citation:

SHEN Wei, PENG Li-hua, LI Wei, et al. DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST[J]. Acta Materiae Compositae Sinica, 2001, 18(2): 90-93.

沈为, 彭立华, 李伟, 等. 用热弯实验方法决定导电薄膜的热膨胀系数[J]. 复合材料学报, 2001, 18(2): 90-93.

引用本文:

沈为, 彭立华, 李伟, 等. 用热弯实验方法决定导电薄膜的热膨胀系数[J]. 复合材料学报, 2001, 18(2): 90-93.

SHEN Wei, PENG Li-hua, LI Wei, et al. DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST[J]. Acta Materiae Compositae Sinica, 2001, 18(2): 90-93.

Citation:

SHEN Wei, PENG Li-hua, LI Wei, et al. DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST[J]. Acta Materiae Compositae Sinica, 2001, 18(2): 90-93.

用热弯实验方法决定导电薄膜的热膨胀系数

1.
华中理工大学力学系,武汉 430074;
2.
武汉水利电力大学结构力学教研室,武汉 430072;
3.
香港理工大学制造工程系, 香港

基金项目: 国家自然科学基金项目(19672019,19972022)

中图分类号: TB332; TM24
计量
- 文章访问数: 1272
- PDF下载量: 716
- 被引次数: 0
出版历程
- 收稿日期: 2000-01-19
- 修回日期: 2000-05-15
- 刊出日期: 2001-05-15

DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST

1.
Department of Mechanics, Huazhong University of Science and Technology, 430074,China;
2.
Structure Mechanics Research Group, Wuhan University of Hydraulic and Electric Engineering, 430072,China;
3.
Department of Manufacturing Engineering, The Hong Kong Polytechnic University,Hong Kong, China

摘要: 研究了热-力载荷下薄膜/基板复合梁的弯曲问题,导出了薄膜的热膨胀系数与试样表面的温度和变形之间的关系式;提出一种测量导电薄膜的热膨胀系数的方法,并用热弯实验测SnO₂膜的热膨胀系数。
- 导电膜/玻璃 /
- 热膨胀系数 /
- 电热效应 /
- 热弯实验
Abstract: The bending problem of thin film/substrate composite subjected to thermal load is studied. The relation between the thermal expansion coefficient of conductive thin films, temperature and deformation of specimen surfaces is derived in this paper. Based on the findings, a method for measuring the thermal expansion coefficient of conductive thin films is developed. The thermal expansion coefficient of conductive thin films has been measured by applying the method in a thermal bend test.
- conductive thin film /
- thermal expansion coefficient /
- electro-thermal effect /
- thermal bend test

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