APPLICATION OF EMBEDDED ELASTIC ZONE AND COHESIVE MODEL TO THIN FILM/SUBSTRATE INTERFACIAL FRACTURE
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摘要: 薄膜/基底结构是微电子学和材料科学中广泛应用的典型结构。由于加工工艺中材料力学、热学性能失配等原因导致的薄膜中出现的残余应力,是界面裂纹的萌生和扩展的重要原因。采用三参数(Γ0, /σy,t)的修正的断裂过程区结合力模型,讨论了在塑性氛围下裂尖解理断裂的过程,裂尖应力分布,裂尖形貌和表征裂纹尖端断裂过程区特征参数对断裂过程的影响,并应用到均质金属薄膜/陶瓷基底结构中残余应力导致界面裂纹起裂和扩展的全过程分析中。Abstract: Film/substrate structure is a basic structure widely used in microelectronic and materials science and technology. The residual stress in the film induced by mechanical and thermal mismatch in the manufacture is an important cause of initiation and extension of interface cracks. The modified three-parameter (Γ0, /σy,t) cohesive model was used to investigate the cleavage fracture under plastic atmosphere, the stress distribution in crack tip, the shape and physiognomy of crack tip and the influence of the parameter on the fracture process. The model was also used to discuss the whole process of the initiation and extension of an interface crack between a uniform metal thin film and a ceramic substrate under residual stresses.
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