SHS/QP制备(TiB<sub>2</sub>+Fe)/Fe叠层材料的结构与性能分析

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SHS/QP制备(TiB₂+Fe)/Fe叠层材料的结构与性能分析

刘建平, 傅正义, 王皓, 张金咏, 张清杰

文章导航 > 复合材料学报 > 2003 > 20(1): 116-120

刘建平, 傅正义, 王皓, 等. SHS/QP制备(TiB2+Fe)/Fe叠层材料的结构与性能分析[J]. 复合材料学报, 2003, 20(1): 116-120.

引用本文:

刘建平, 傅正义, 王皓, 等. SHS/QP制备(TiB₂+Fe)/Fe叠层材料的结构与性能分析[J]. 复合材料学报, 2003, 20(1): 116-120.

LIU Jianping, FU Zhengyi, WAN Hao, et al. FABRICATION OF (TiB2+Fe)/Fe LAYERED MATERIALS BY SHS/QP PROCESS——ANALYSIS OF THE STRUCTURE AND PERFORMANCE[J]. Acta Materiae Compositae Sinica, 2003, 20(1): 116-120.

Citation:

LIU Jianping, FU Zhengyi, WAN Hao, et al. FABRICATION OF (TiB₂+Fe)/Fe LAYERED MATERIALS BY SHS/QP PROCESS——ANALYSIS OF THE STRUCTURE AND PERFORMANCE[J]. Acta Materiae Compositae Sinica, 2003, 20(1): 116-120.

刘建平, 傅正义, 王皓, 等. SHS/QP制备(TiB2+Fe)/Fe叠层材料的结构与性能分析[J]. 复合材料学报, 2003, 20(1): 116-120.

引用本文:

刘建平, 傅正义, 王皓, 等. SHS/QP制备(TiB₂+Fe)/Fe叠层材料的结构与性能分析[J]. 复合材料学报, 2003, 20(1): 116-120.

LIU Jianping, FU Zhengyi, WAN Hao, et al. FABRICATION OF (TiB2+Fe)/Fe LAYERED MATERIALS BY SHS/QP PROCESS——ANALYSIS OF THE STRUCTURE AND PERFORMANCE[J]. Acta Materiae Compositae Sinica, 2003, 20(1): 116-120.

Citation:

LIU Jianping, FU Zhengyi, WAN Hao, et al. FABRICATION OF (TiB₂+Fe)/Fe LAYERED MATERIALS BY SHS/QP PROCESS——ANALYSIS OF THE STRUCTURE AND PERFORMANCE[J]. Acta Materiae Compositae Sinica, 2003, 20(1): 116-120.

SHS/QP制备(TiB₂+Fe)/Fe叠层材料的结构与性能分析

武汉理工大学材料复合新技术国家重点实验室, 武汉 430070

基金项目: 国家杰出青年科学基金(59925207)

作者简介:
刘建平(1976-),男,硕士研究生, 主要从事陶瓷-金属复合材料研究。

通讯作者:
傅正义, E-mail: zyfu@public.wh.hb.cn

中图分类号: TF12
计量
- 文章访问数: 1443
- PDF下载量: 744
- 被引次数: 0
出版历程
- 收稿日期: 2001-08-20
- 修回日期: 2001-12-21
- 刊出日期: 2003-02-15

FABRICATION OF (TiB₂+Fe)/Fe LAYERED MATERIALS BY SHS/QP PROCESS——ANALYSIS OF THE STRUCTURE AND PERFORMANCE

State Key Lab of Advanced Technology for Materials Synthesis and Processing,Wuhan University of Technology,Wuhan 430070,China

摘要: 采用SHS/QP工艺制备了(TiB₂+Fe)/Fe叠层材料。SEM分析表明TiB₂+Fe金属陶瓷层结构致密。用EPMA研究了TiB₂+Fe金属陶瓷层与Fe基片之间的界面连接机制,结果表明TiB₂从TiB₂+Fe侧向Fe基片侧进行扩散,以及TiB₂+Fe层中的Fe粘结相和Fe基片的粘接完成了(TiB₂+Fe)/Fe叠层材料的界面连接。叠层材料接头断裂时,断裂位置发生在TiB₂+Fe金属陶瓷层,而不是沿着TiB₂+Fe层与Fe基片的界面断裂。
- (TiB₂+Fe)/Fe叠层材料 /
- SHS/QP /
- 界面结合
Abstract: (TiB₂+Fe)/Fe layered materials were fabricated by SHS/QP process. SEM analysis showed TiB₂+Fe cermet layer in the layered material was fully dense. Interfacial bonding between TiB₂+Fe cermet and Fe substrate was analyzed by EPMA, which showed the interfacial bonding of two-layered product was obtained by the dissolution and the diffusion of TiB₂ in the Fe substrate and joining of Fe binder with Fe substrate. The fracture of joints took place in the TiB₂+Fe cermet layer rather than at the interface.
- (TiB₂+Fe)/Fe layered materials /
- SHS/QP /
- interfacial bonding

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