Sm掺杂核-壳结构介孔SiO<sub>2</sub>@CeO<sub>2</sub>复合颗粒的制备和抛光性能

陈爱莲; 王婉莹; 马翔宇; 蔡文杰; 陈杨

doi:10.13801/j.cnki.fhclxb.20190730.001

Sm掺杂核-壳结构介孔SiO₂@CeO₂复合颗粒的制备和抛光性能

doi: 10.13801/j.cnki.fhclxb.20190730.001

1.
常州大学机械工程学院, 常州 213164;
2.
常州大学江苏省绿色过程装备重点实验室, 常州 213164;
3.
常州大学材料科学与工程学院, 常州 213164

基金项目: 国家自然科学基金（51405038；51575058；51875052）

详细信息

通讯作者:
陈杨,副教授,研究方向为复合材料及摩擦学,E-mail:cy.jpu@126.com

中图分类号: TB383
计量
- 文章访问数: 695
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- 被引次数: 0
出版历程
- 收稿日期: 2019-04-30
- 刊出日期: 2020-04-15

Sm-doped core-shell structured mesoporous SiO₂@CeO₂ composite particles: Preparation and polishing performance

1.
School of Mechanical Engineering, Changzhou University, Changzhou 213164, China;
2.
Jiangsu Key Laboratory of Green Process Equipment, Changzhou University, Changzhou 213164, China;
3.
School of Materials Science and Engineering, Changzhou University, Changzhou 213164, China

摘要

摘要: 在低模量介孔SiO₂ （Mesoporous silica，mSiO₂）微球表面负载Sm掺杂CeO₂纳米粒子，制备了具有均匀完整核-壳结构的非刚性mSiO₂@Ce_{1-xSm_xO₂（x=0，0.23）复合颗粒。借助XRD、SEM、HRTEM、STEM-EDX Mapping、Raman光谱和N₂吸-脱附等技术对产物进行结构表征，利用AFM和三维光学轮廓仪评价Sm元素掺杂处理对mSiO₂@Ce_{1-xSm_xO₂（x=0，0.23）复合颗粒抛光效果的影响。讨论了Sm掺杂复合磨粒的高效无损超精密抛光机制。结果表明：掺杂处理可使mSiO₂@Ce_{1-xSm_xO₂（x=0，0.23）复合颗粒的抛光效率提高近36%，达到84 nm/min，同时获得具有原子量级精度的加工表面，抛光后SiO₂薄膜的粗糙度平均值和均方根分别为0.14和0.17 nm。}}}
- CeO₂ /
- 掺杂 /
- 复合磨粒 /
- 核-壳结构 /
- 抛光
Abstract: The mesoporous silica (mSiO₂) microspheres were grafted with the Sm-doped CeO₂ nanoparticles via a facile and efficient co-precipitation approach. The uniform non-rigid mSiO₂@Ce_{1-xSm_xO₂(x=0, 0.23) composite particles with a well-defined core-shell structure were obtained. The resulting samples were characterized in terms of powder XRD, SEM, HRTEM, STEM-EDX Mapping, Raman, and N₂ adsorption-desorption measurements. The effects of Sm doping on the polishing performance of mSiO₂@Ce_{1-xSm_xO₂(x=0, 0.23) composite abrasives were evaluated using AFM and three-dimensional noncontact interferometric microscope. The ultra-precision and high-efficiency polishing mechanisms of the Sm-doped abrasives were also discussed. The polishing results show that the Sm doping contributes to 36% increment of the removal rate which is 84 nm/min compared to the undoped composites. The Sm-doped abrasives achieve an atomic-scale surface finish, and the average roughness and root-mean-square roughness of the polished SiO₂ films are 1.4 and 0.17 nm, respectively.}}
- CeO₂ /
- doping /
- composite abrasive /
- core-shell structure /
- polishing