添加微量Ti 元素对Diamond/Cu复合材料组织及性能的影响

添加微量Ti 元素对Diamond/Cu复合材料组织及性能的影响

Effect of Ti on microstructures and properties of Diamond/Copper composites

摘要

摘要: 分别采用在Cu基体添加0. 1 wt%的Ti 元素形成Cu₂Ti合金和在Diamond 颗粒表面镀钛(Diamond^Ti) 的方法, 制备了含Diamond 体积分数为60 %的Diamond/Cu₂Ti 复合材料和Diamond^Ti/Cu 复合材料。对比分析了Ti 元素对复合材料微观组织、界面结合及性能的影响规律。结果表明: 添加0. 1 wt%Ti 元素能改善Diamond与Cu 的界面结合, 在界面处观察到明显的碳化物反应层; 且以Cu₂Ti合金的方式添加Ti 元素改善界面的效果优于在Diamond 颗粒表面镀Ti 的方式。所制备的Diamond/Cu₂Ti 复合材料的热导率为621 W(m·K) ^{- 1}, 而Diamond^Ti/Cu复合材料的热导率仅为403. 5 W(m·K) ^-1, 但均高于未添加Ti 制备的Diamond/Cu 复合材料。

Abstract: Diamond/Cu₂Ti and DiamondTi/Cu composites with 60 % volume fraction diamond were manufactured by a pressure infilt ration process. The effects of Ti on the microstructure, interface and properties of diamond/copper composites were comparatively analyzed. The results show that the addition of 0. 1 wt% Ti can greatly improve the interface bonding between copper and diamond. Carbide lamellae can be observed obviously on the interface. By contrast, the interface of Diamond/ Cu₂Ti composites fabricated by adding Ti element in copper to form Cu₂Ti alloy is better than that of Diamond^Ti/Cu composites (Diamond^Ti : Diamond coated with Ti). The thermal conductivity of Diamond/Cu₂Ti composites is 621 W(m·K)^-1 and that of Diamond^Ti/Cu composites is 403. 5 W(m·K)^-1, both of which are higher than the thermal conductivity of Diamond/Cu composites.

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