添加微量Ti 元素对Diamond/Cu复合材料组织及性能的影响
详细信息Effect of Ti on microstructures and properties of Diamond/Copper composites
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摘要: 分别采用在Cu基体添加0. 1 wt%的Ti 元素形成Cu2Ti合金和在Diamond 颗粒表面镀钛(DiamondTi) 的方法, 制备了含Diamond 体积分数为60 %的Diamond/Cu2Ti 复合材料和DiamondTi/Cu 复合材料。对比分析了Ti 元素对复合材料微观组织、界面结合及性能的影响规律。结果表明: 添加0. 1 wt%Ti 元素能改善Diamond与Cu 的界面结合, 在界面处观察到明显的碳化物反应层; 且以Cu2Ti合金的方式添加Ti 元素改善界面的效果优于在Diamond 颗粒表面镀Ti 的方式。所制备的Diamond/Cu2Ti 复合材料的热导率为621 W(m·K) - 1, 而DiamondTi/Cu复合材料的热导率仅为403. 5 W(m·K) -1, 但均高于未添加Ti 制备的Diamond/Cu 复合材料。
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关键词:
- 压力熔渗 /
- Diamond/Cu 复合材料 /
- Ti /
- 合金化 /
- 热导率
Abstract: Diamond/Cu2Ti and DiamondTi/Cu composites with 60 % volume fraction diamond were manufactured by a pressure infilt ration process. The effects of Ti on the microstructure, interface and properties of diamond/copper composites were comparatively analyzed. The results show that the addition of 0. 1 wt% Ti can greatly improve the interface bonding between copper and diamond. Carbide lamellae can be observed obviously on the interface. By contrast, the interface of Diamond/ Cu2Ti composites fabricated by adding Ti element in copper to form Cu2Ti alloy is better than that of DiamondTi/Cu composites (DiamondTi : Diamond coated with Ti). The thermal conductivity of Diamond/Cu2Ti composites is 621 W(m·K)-1 and that of DiamondTi/Cu composites is 403. 5 W(m·K)-1, both of which are higher than the thermal conductivity of Diamond/Cu composites.-
Keywords:
- pressure infilt ration /
- Diamond/Cu composites /
- Ti /
- alloy /
- thermal conductivity
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