Microstructure and properties of C_f/Cu composites prepared by one-step hot-pressing sintering

For get ting better properties and simplifying the process, the C_f/Cucomposites were prepared by one-step hot-pressing sintering. The mechanism of the interface reaction between Cu and carbon fiber (C_f) and the microstructure of C_f/Cu composites were studied. The effects of different Ti contents on the density, hardness and bending strength of C_f/Cu composites were investigated. The results indicate that TiC layer surrounding C_f is generated in the ternary system of Cu₂C₂Ti and the TiC layer decreases the wetting angle between the liquid Cu and the solid C_f, which improves the combination between Cu and C_f. The mechanism of formation of TiC layer was discussed and a microstructure model of the reaction between Ti dissolved in the liquid Cu and C was brought forward. The formation of TiC layer is good for increasing the properties of the composites. When the mass fraction of Ti is 16. 7 %, the synthetic properties of the composites are the best in this system with Shore hardness HS66.94 and flexural strength 97. 59 MPa.