Research status and development trend of composite materials for phased array radar T/R module packaging

CHENG Dongfeng; HU Xiaoyu; ZHOU Da; QIU Dechao; FAN Siyan; HE Peng; NIU Jitai

doi:10.13801/j.cnki.fhclxb.20230119.005

Volume 40 Issue 8

May 2023

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Article Navigation > Acta Materiae Compositae Sinica > 2023 > 40(8): 4440-4459

CHENG Dongfeng, HU Xiaoyu, ZHOU Da, et al. Research status and development trend of composite materials for phased array radar T/R module packaging[J]. Acta Materiae Compositae Sinica, 2023, 40(8): 4440-4459. doi: 10.13801/j.cnki.fhclxb.20230119.005

Citation:

CHENG Dongfeng, HU Xiaoyu, ZHOU Da, et al. Research status and development trend of composite materials for phased array radar T/R module packaging[J]. Acta Materiae Compositae Sinica, 2023, 40(8): 4440-4459. doi: 10.13801/j.cnki.fhclxb.20230119.005

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Research status and development trend of composite materials for phased array radar T/R module packaging

doi: 10.13801/j.cnki.fhclxb.20230119.005

CHENG Dongfeng^{1, 2},
HU Xiaoyu¹,
ZHOU Da¹,
QIU Dechao¹,
FAN Siyan¹,
HE Peng³,
NIU Jitai^{1, 2, 3
,
,}

1.
School of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454000, China
2.
Henan Province Structural Functional Metal Matrix Composite Engineering Technology Research Center, Jiaozuo 454000, China
3.
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

Funds: National Natural Science Foundation of China (51245008); Science and Technology Project of Henan Province (222102220006); Key Project of Science and Technology Research of Henan Provincial Department of Education (22B430016); Ph.D Foundation Program of Henan Polytechnic University (B2019-38)

Received Date: 2022-10-20
Accepted Date: 2023-01-03
Rev Recd Date: 2022-12-05

Available Online: 2023-01-20

Publish Date: 2023-08-15

Abstract

Abstract

With the rapid development of aerospace, military, and electronic technologies, packaging methods and packaging materials have become important constraints for electronic devices to further achieve miniaturization, lightweight, and high performance. Phased array radar T/R module packaging materials have experienced from the first generation of Kovar alloy to the second generation of copper-tungsten alloy, and the emergence of the third generation of lightweight materials with aluminum as the matrix in recent years-silicon carbide particle reinforced aluminum matrix composite material and high silicon aluminum alloy, and the problems in the preparation and processing technology of the two have become an important bottleneck restricting the comprehensive promotion and application of the third generation of materials. In this paper, the preparation methods, machining properties, welding processes, and surface treatment of the new generation of packaging materials are reviewed, and the research technology status of the processing and application of the new generation of phased array radar T/R module packaging composites is introduced in detail, and its development trend prospects.
- T/R module,
- electronic packaging,
- SiC particle reinforced,
- Al matrix composites,
- high silicon aluminum,
- preparation and processing
Long Abstrsct
Innovation Points

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References(103)

References

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