A new high temperature bismaleimide resin system with improved processability are prepared,which consists of a hot melting mixture of two bismaleimides and divinylbenzene.One of two bismaleimides is 4,4'-bisma leidodiphenylmethane,a comercial product, and another is a substituted bismaleimide which was synthesised by ourselves.This new bismalcimide resin system has a low melting point (about 60℃),better solubility (soluble in aceton,solution can be used in making prepreg), and low curing temperature(180℃).Composite fabricated from this resin exhibits high thermal stability,and its strength retentivity at 250℃ is more than 60%.
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