Cure kinetics and TTT2diagram of a bicomponent high performanceepoxy resin for advanced composites

The cure kinetics of a bicomponent high performance epoxy resin was studied by dynamic DSC analysis ,and the parameters of the cure reaction were obtained to establish a phenomenological model. The relationshipbetween glass t ransition temperature ( T_g ) and cure degree (α) was analyzed with an isothermal plus dynamic DSCmethod based on DiBenedetto equation , and a mathematical description of T_g as a function of both time and temperature was suggested. Round disk compression mode DMA was employed to study the gelation at different temperatures , and the relationship between gel-time and temperature was obtained. The conversion at gelation turned out tobeα_gel = 0. 4539 , while the temperature at which vit rification line and gelation line t ransected was found to be Tg ,gel =70. 18 ℃. The time-temperature-transition ( TTT) diagram was plotted based on the works above , which served as atool for process optimization in advanced composites manufacture.