Simulation of curing process of epoxy resin with embedded FBGs  considering interfacial strain transfer mechanism

LEI Weihua; HU Haixiao; CAO Dongfeng; XIAO Lei; TIAN Yizhou; LI Shuxin; WANG Jingnan

doi:10.13801/j.cnki.fhclxb.20220419.002

Volume 40 Issue 3

Mar. 2023

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LEI Weihua, HU Haixiao, CAO Dongfeng, et al. Simulation of curing process of epoxy resin with embedded FBGs considering interfacial strain transfer mechanism[J]. Acta Materiae Compositae Sinica, 2023, 40(3): 1807-1817. doi: 10.13801/j.cnki.fhclxb.20220419.002

Citation:

LEI Weihua, HU Haixiao, CAO Dongfeng, et al. Simulation of curing process of epoxy resin with embedded FBGs considering interfacial strain transfer mechanism[J]. Acta Materiae Compositae Sinica, 2023, 40(3): 1807-1817. doi: 10.13801/j.cnki.fhclxb.20220419.002

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Simulation of curing process of epoxy resin with embedded FBGs considering interfacial strain transfer mechanism

doi: 10.13801/j.cnki.fhclxb.20220419.002

LEI Weihua^{1, 2
,},
HU Haixiao^{1, 2, 4
,
,},
CAO Dongfeng^{2, 3, 4
,
,},
XIAO Lei^{1, 2},
TIAN Yizhou³,
LI Shuxin^{1, 2, 3, 4},
WANG Jingnan⁵

1.
Hubei Key Laboratory of Theory and Application of Advanced Materials Mechanics, Wuhan University of Technology, Wuhan 430070, China
2.
Foshan Xianhu Laboratory of the Advanced Energy Science and Technology Guangdong Laboratory, Foshan 528000, China
3.
State Key Laboratory of Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China
4.
Institute of Advanced Materials and Manufacturing Technology, Wuhan University of Technology, Wuhan 430070, China
5.
Wuhan Haiwei Marine & Ocean Engineering Technology CO., LTD., Wuhan 430070, China

Funds: Foundation of Foshan Xianhu Laboratory of the Advanced Energy Science and Technology Guangdong Laboratory (XHT2020-002)

Received Date: 2022-03-08
Accepted Date: 2022-04-05
Rev Recd Date: 2022-04-01

Available Online: 2022-04-20

Publish Date: 2023-03-15

Abstract

Abstract

The strain transfer mechanism between fiber Bragg grating sensor (FBGs) and matrix, which is the basic problem of cure monitoring, was explored by combining of experimental and numerical analysis. Firstly, curing kinetics, thermal expansion, chemical shrinkage and glass transition behavior of the resin were characterized. Then, the developments of temperature and strain were monitored by thermocouple and FBGs during the curing process of epoxy resin. Finally, the thermal-chemical-mechanical multi-field coupling numerical analysis was used to simulate the curing process. The interface transfer mechanism was discussed by comparing the results of pure resin model, FBGs model with binding constraint and FBSs model with cohesive behavior. The results indicate that the strain monitored by FBGs is significantly smaller than that of the resin due to the shear lag effect and interface slip behavior at the early curing stage, and the shear lag effect plays a dominant role. The interfacial strain transfer mechanism during curing process can be described properly by cohesive behavior, and the error between numerical prediction and experimental value is small.
- cure monitoring,
- interface,
- strain transfer,
- fiber Bragg grating sensor (FBGs),
- numerical analysis
Long Abstrsct
Innovation Points

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References(25)

References

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