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LI Weidong, ZHANG Jindong, LIU Gang, et al. Curing reaction kinetics and TTT diagram of high toughness bismaleimide resin[J]. Acta Materiae Compositae Sinica, 2016, 33(7): 1475-1483. DOI: 10.13801/j.cnki.fhclxb.20151030.001
Citation: LI Weidong, ZHANG Jindong, LIU Gang, et al. Curing reaction kinetics and TTT diagram of high toughness bismaleimide resin[J]. Acta Materiae Compositae Sinica, 2016, 33(7): 1475-1483. DOI: 10.13801/j.cnki.fhclxb.20151030.001
shu

Curing reaction kinetics and TTT diagram of high toughness bismaleimide resin

  • 1.

    Key Laboratory of Advanced Composites, Beijing Institute of Aeronautical Materials, AVIC Composite Corporation LTD, Beijing 100095, China;

  • 2.

    School of Materials Science and Engineering, Beihang University, Beijing 100083, China

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  • Received Date: August 27, 2015
  • Revised Date: September 28, 2015
  • Accepted Date: September 28, 2015
    Abstract
  • The curing reaction kinetics of high toughness bismaleimide resin was studied by dynamic DSC method, and the parameters of the curing kinetics for bismaleimide resin were obtained to establish a phenomenological model based on Kissinger and Crane equations. The function relationship between glass transition temperature and curing degree was established with isothermal DSC method based on DiBenedetto equation. By using gelation disk method, gel-time of the resin was obtained under different temperatures. The function relationship between gel-time and gel-temperature was established. The Time-Temperature-Transition (TTT) diagram of resin was obtained to optimize the curing process of the composites. The results show that the prepreg under 150℃ and kept 0.5 h then pressed 0.6 MPa, the resin has a certain mobility and the perfect internal quality composites could be obtained.
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