激光-磨削复合加工2.5维C/SiC复合材料凹槽

王健; 陈冰; 徐虎; 焦浩文; 苏飞

doi:10.13801/j.cnki.fhclxb.20220223.003

激光-磨削复合加工2.5维C/SiC复合材料凹槽

doi: 10.13801/j.cnki.fhclxb.20220223.003

湖南科技大学　机电工程学院，湘潭 411201

基金项目: 国家自然科学基金面上项目(52175401)；湖南省研究生科研创新项目(QL20210239)

详细信息

通讯作者:
陈冰，博士，副教授，硕士生导师，研究方向为难加工材料的精密加工及其加工过程的在线监测技术　E-mail: chenbing@hnust.edu.cn

中图分类号: TB332
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出版历程
- 收稿日期: 2021-11-19
- 修回日期: 2022-01-10
- 录用日期: 2022-01-26
- 网络出版日期: 2022-02-25
- 刊出日期: 2022-12-01

Laser-grinding compound processing of 2.5 dimensional C/SiC composite grooves

School of Mechanical and Engineering, Hunan University of Science and Technology, Xiangtan 411201, China

摘要

摘要: 针对2.5维碳纤维增强碳化硅陶瓷基(C/SiC)复合材料凹槽在激光加工后存在一定的烧蚀氧化层、侧壁倾斜、底面不平坦和磨削加工后易出现破碎、纤维断裂、刀具磨损、形状精度低、效率低等问题，提出激光-磨削复合加工的方法。为探索激光-磨削复合加工2.5维C/SiC复合材料凹槽的可行性，进行了激光加工、磨削加工和激光-磨削复合加工凹槽的对比实验。研究表明：激光加工后的凹槽侧壁倾斜约23°，底面和侧壁表面质量均较差，但加工效率高；磨削加工后的凹槽表面质量得到一定提升，但是由于砂轮磨损剧烈，使磨削后的凹槽形状精度极差，且加工效率较低；而激光-磨削复合加工后的凹槽侧壁倾斜度被去除，砂轮磨损大幅降低，表面质量显著提升，凹槽表面粗糙度比磨削后的表面粗糙度提高了1.27~1.96倍，加工时间约为磨削加工的0.3倍。因此，激光-磨削复合加工不仅能克服激光加工和磨削加工的缺点，还能发挥激光加工效率高和磨削加工精度高的特点，同时兼顾了2.5维C/SiC复合材料凹槽加工的质量和效率。该研究结果可为2.5维C/SiC复合材料凹槽的高效、精密、低损伤加工提供理论支持。
- C/SiC复合材料 /
- 激光-磨削复合加工 /
- 侧壁倾斜 /
- 表面质量 /
- 砂轮磨损
Abstract: There were many problems after 2.5 dimensional carbon fiber reinforced SiC ceramic matrix (C/SiC) composite processed by nanosecond lasers, such as ablative oxide layer, sidewall slope, uneven bottom surface, and many problems also remained in grinding processing, breakage of fiber and matrix, fiber fracture, tool wear, low shape accuracy, low efficiency and so on, the laser-grinding compound processing method was proposed. To explore the feasibility of laser-grinding compound processing of 2.5 dimensional C/SiC composite grooves, the grooves experiment of laser processing, grinding processing and laser-grinding composite processing were carried out. The results show that the slope of the side wall of the groove by laser processing is about 23°, the surface quality of the bottom and side wall is poor, but the processing efficiency is high. To a certain extent, the surface quality of the grooves by grinding is improved, but the shape precision of the grooves after grinding is extremely poor and the processing efficiency is lower because of the severe wear of the grinding wheel. However, after laser-grinding compound processing, slope of groove sidewall is removed, the grinding wheel wear is greatly reduced, and the surface quality is significantly improved, roughness of the groove surface is 1.27-1.96 times higher than that after grinding, the processing time is about 0.3 of that of grinding. Therefore, the laser-grinding compound processing can not only overcome the shortcomings of laser processing and grinding processing, but also give play to the characteristics of high laser processing efficiency and grinding accuracy, and take into account the quality and efficiency of groove processing of 2.5 dimensional C/SiC composites. The results can provide theoretical support for efficient, precise and low damage processing of 2.5 dimensional C/SiC composite grooves.
- C/SiC composite /
- laser-grinding compound processing /
- sidewall slope /
- surface quality /
- wheel wear

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图 1 2.5维C/SiC复合材料排布方式及其微观形貌^[21]

Figure 1. Structural model and microstructures of 2.5-dimensional C/SiC composite^[21]

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图 2 C/SiC复合材料的加工过程图

Figure 2. Processing diagram of C/SiC composite

C₁, C₂—Maximum rectangular trajectory perimeter during laser scanning, minimum rectangular trajectory perimeter during laser scanning; v₁, v₂—Nanosecond laser scanning speed, grinding wheel feed speed; B—Width of the groove; L—Length of the groove; n—Grinding wheel speed; H—Depth of the groove; L—Length of the groove

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图 3 C/SiC复合材料的实验加工系统

Figure 3. Experimental processing system of C/SiC composite

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图 4 2.5维C/SiC复合材料不同加工方式后的凹槽截面SEM图像

Figure 4. SEM images of groove of 2.5-dimensional C/SiC composite cross-section after different machining methods

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图 5 2.5维C/SiC复合材料不同加工方式后的凹槽底面形貌图

Figure 5. Bottom surface maps of groove of 2.5-dimensional C/SiC composite after different processing methods

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图 6 C/SiC复合材料不同加工方式后横向纤维区域磨削加工微观形貌图

Figure 6. Microtopographies of transverse fiber area of C/SiC composite grinded after different processing methods

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图 7 C/SiC复合材料不同加工方式后纵向纤维区域磨削加工微观形貌图

Figure 7. Microtopographies of longitudinal fiber area of C/SiC composite grinded after different processing methods

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图 8 C/SiC复合材料不同加工方式后针刺纤维区域磨削加工微观形貌图

Figure 8. Microtopographies of needle punched fiber area of C/SiC composite grinded after different processing methods

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图 9 C/SiC复合材料不同加工方式后的侧壁形貌图

Figure 9. Sidewall topographies of C/SiC composite after different processing methods

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图 10 C/SiC复合材料加工表面EDS成分检测图

Figure 10. EDS component detection diagram of C/SiC composite processed surface

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图 11 C/SiC复合材料加工后的砂轮表面形貌图

Figure 11. Surface topography of C/SiC composite grinding wheel after machining

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表 1 碳纤维增强碳化硅陶瓷基(C/SiC)复合材料的参数

Table 1. Mechanical properties of carbon fiber reinforced SiC ceramic matrix (C/SiC) composites

Parameter	Value
Density/(g·cm⁻³)	1.85-1.95
Porosity/%	<10
Tensile strength/MPa	75-100
Bending strength/MPa	240-300
Compressive strength/MPa	420-500
Shear strength/MPa	15-25
Rockwell hardness/HRC	85-90
Thermal diffusivity/(cm²·s⁻¹)	0.03-0.06
Thermal conductivity/(W·(m·K)⁻¹)	8-10

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表 2 纳秒激光加工的特征参数

Table 2. Properties of nanosecond laser processing

Parameter	Pulse-width/ns	Repetition rate/kHz	Power/W	Focal displacement/μm	Scanning speed v₁/(mm·s⁻¹)
Value	20	200	90	100	300

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表 3 C/SiC复合材料不同加工方式下所用的加工时间及加工后的表面粗糙度

Table 3. Processing time used in different processing methods and the surface roughness after processing C/SiC composite

Processing methods	Nanosecond laser	Grinding	Laser-grinding compound processing
Processing time/s	80	8000	2420
Roughness of bottom surface R_a/μm	–	3.43	1.16
Sidewall surface roughness/μm	–	3.48	1.53

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