Interface connection mechanism and fracture behavior of nickel-based composites fabricated by selective laser melting
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摘要: 基于颗粒增强镍基复合材料优异的结构/功能特性，在航空航天、核电军工和电子电工等领域有着广泛的应用前景。本文选用机械球磨混粉+激光选区熔化方法(SLM)制备了碳化钨(WC)颗粒增强IN718复合材料(WC/IN718)，对复合材料内部异质界面连接机制、强化机制和断裂行为进行了分析。研究结果表明：随着WC颗粒含量的增加(0wt%~20wt%)，试件成形良好，WC颗粒均匀分布在基体内部，异质界面处无缺陷产生，界面处产生了贫碳的W2C层和碳化物层，基体合金主要呈柱状晶生长。由于熔池内部能量密度分布不同，低温位置WC颗粒的断裂方式为先形成界面反应层后由热应力引起断裂，高温位置WC颗粒优先发生断裂，断裂成小尺寸颗粒，后与熔化的基体合金形成界面反应层，弥散分布在基体内部。随着WC颗粒含量的增加，复合材料的强度呈现升高的趋势，而断裂韧性降低，抗拉强度最高可达1280 MPa，强化机制主要为载荷传递强化，断裂机制为WC颗粒的脆性断裂和基体合金的韧性断裂。
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关键词:
- WC/IN718复合材料 /
- 异质界面连接 /
- 断裂机制 /
- 强化机制 /
- 颗粒增强镍基复合材料
Abstract: Based on the excellent structural/functional properties of particle-reinforced nickel-based composites, they have a wide application prospects in aerospace, nuclear power, military industry and electronics. The internal heterogeneous interface connection mechanism, reinforcement mechanism and fracture behavior of the tungsten carbide (WC) particle-reinforced IN718 composites (WC/IN718) prepared by using the mechanical ball grinding powder+selective laser melting (SLM) was analyzed. The results show that with the increase of WC particles content (0wt%-20wt%), the specimen is well-formed, WC particles are evenly distributed inside the matrix and no defects at the heterogeneous interface, carbon-poor W2C layer and carbide layer are produced at the interface, and the matrix alloy mainly grows at the form of columnar crystals. Due to the different energy density distribution within the melting pool, the fracture mode of WC particles at the low temperature position is that firstly the interface reaction layer form at the periphery of WC particle and then WC are fractured by thermal stress. However, WC particles at the high temperature position preferentially break into small particles in size, and then the interface reaction layer is formed with the molten matrix alloy, which is distributed within the matrix. As the content of WC particles increases, the strength of composites tends to increase, while the fracture toughness is reduced, and the tensile strength can be up to 1280 MPa. The reinforcement mechanism is mainly the load transfer effect, the fracture mechanism is the brittle fracture of WC particles and the toughness fracture of matrix alloy. -
图 1 IN718 (a)、球形碳化钨(WC) (b) 的SEM图像；(c) 异种粉末球磨混合示意图；(d) 20wt%WC/IN718混合粉末的SEM图像；(e) 激光选区熔化法(SLM)路径扫描示意图；(f) 打印的成型件宏观形貌图
Figure 1. SEM images of IN718 (a), spherical tungsten carbide (WC) (b); (c) Heterologous powder ball grinding mixing diagram; (d) SEM image of 20wt%WC/IN718 composites powder by mixing; (e) Illustration of selective laser melting (SLM) scanning path; (f) Macro topography of fabricated composites part
n—Layer; R—Radius
图 2 不同工艺参数下SLM增材制造WC/IN718复合材料金相组织：10%WC/IN718：(a) 190 W；(b) 200 W；(c) 210 W；15%WC/IN718：(d) 190 W；(e) 200 W；(f) 210 W；20%WC/IN718：(j) 190 W；(h) 200 W；(i) 210 W
Figure 2. Microstructures of WC/IN718 composites fabricated by SLM under different process parameters: 10%WC/IN718: (a) 190 W; (b) 200 W; (c) 210 W; 15%WC/IN718: (d) 190 W; (e) 200 W; (f) 210 W; 20%WC/IN718: (j) 190 W; (h) 200 W; (i) 210 W
图 3 IN718合金及WC颗粒形貌：(a) IN718；(b) 20%WC/IN718；((c)~(d)) 20%WC/IN718复合材料内部WC颗粒形貌图
Figure 3. Microstructures of IN718 alloy and WC particles: (a) IN718; (b) 20%WC/IN718; ((c)-(d)) Morphologies of WC particle inside the 20%WC/IN718 composites
图 4 10wt%WC/IN718增强复合材料EBSD三维图
Figure 4. EBSD spectrum of the 10wt%WC/IN718 enhanced composite
图 5 SLM打印的IN718及其复合材料XRD图谱
Figure 5. XRD patterns of IN718 and composites printed by SLM
图 6 10wt%WC/IN718复合材料SEM图像：(a) WC颗粒与IN718基体熔融结合界面；(b) 结合界面局部放大图；(c)界面的EDS面扫描图谱；(d)界面的EDS线扫描图谱；(e)图6(b)中界面标定点的EDS点扫描图谱
Figure 6. SEM image of 10wt%WC/IN718 composite: (a) Fusion binding interface between WC particles and IN718 matrix; (b) Local magnification plot of the binding interface; (c) EDS surface scan map of the interface; (d) EDS line scan map of the interface; (e) EDS point scan map of the calibration points in Fig.6 (b)
图 7 WC/IN718复合材料内部WC的断裂机制示意图
Figure 7. Schematic diagram of fracture mechanism of WC in WC/IN718 composite
图 8 WC/IN718异质界面TEM图像、EDS面扫及点扫能谱图
Figure 8. TEM image, EDS surface scanning and point scanning spectra of WC/IN718 heterogeneous interface
图 11 SLM打印IN718合金与10wt%WC/IN718复合材料及其断口SEM图像
Figure 11. SLM printed IN718 alloy and 10wt%WC/IN718 composite and their SEM image
表 1 球形WC颗粒的化学成分
Table 1. Chemical composition of spherical WC particles
wt% W C Fe Cr Ti Nb Free C Balance 3.90 0.35 0.03 0.03 0.02 0.002 
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表 3 激光加工基本参数
Table 3. Basic parameters of laser processing
Parameter of the laser Value Laser power P/W 190, 200, 210 Scanning speed v/(mm·s−1) 1000 Thickness t/mm 0.03 Scanning interval h/mm 0.05
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表 2 IN718合金的化学成分
Table 2. Chemical composition of IN718 alloy
wt% Ni Cr Nb Mo Ti Co C Al Fe 52 19 5.5 2.5 0.8 0.9 0.05 0.5 Bal
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