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三维多孔氮化铝/环氧树脂复合材料的导热与电性能

王绪彬 张昌海 张天栋 迟庆国

王绪彬, 张昌海, 张天栋, 等. 三维多孔氮化铝/环氧树脂复合材料的导热与电性能[J]. 复合材料学报, 2023, 40(6): 3341-3349. doi: 10.13801/j.cnki.fhclxb.20220905.002
引用本文: 王绪彬, 张昌海, 张天栋, 等. 三维多孔氮化铝/环氧树脂复合材料的导热与电性能[J]. 复合材料学报, 2023, 40(6): 3341-3349. doi: 10.13801/j.cnki.fhclxb.20220905.002
WANG Xubin, ZHANG Changhai, ZHANG Tiandong, et al. Thermal conductivity and electrical properties of three-dimensional porous aluminum nitride/epoxy composites[J]. Acta Materiae Compositae Sinica, 2023, 40(6): 3341-3349. doi: 10.13801/j.cnki.fhclxb.20220905.002
Citation: WANG Xubin, ZHANG Changhai, ZHANG Tiandong, et al. Thermal conductivity and electrical properties of three-dimensional porous aluminum nitride/epoxy composites[J]. Acta Materiae Compositae Sinica, 2023, 40(6): 3341-3349. doi: 10.13801/j.cnki.fhclxb.20220905.002

三维多孔氮化铝/环氧树脂复合材料的导热与电性能

doi: 10.13801/j.cnki.fhclxb.20220905.002
基金项目: 黑龙江省自然科学基金(ZD2020 E009)
详细信息
    通讯作者:

    张天栋,博士,副教授,博士生导师,研究方向为聚合物电容薄膜改性研究、橡胶基复合绝缘材料研发、电子封装绝缘材料研发  E-mail: tdzhang@hrbust.edu.cn

  • 中图分类号: TM215.92;TB332

Thermal conductivity and electrical properties of three-dimensional porous aluminum nitride/epoxy composites

Funds: Natural Science Foundation of Heilongjiang Province (ZD2020 E009)
  • 摘要: 环氧树脂(EP)是一种典型的电子封装绝缘材料,但其导热系数(小于0.2 W/(m·K))较低,提高其导热性是解决电子器件散热问题的有效办法。本文通过构筑三维多孔的氮化铝骨架(3D-AlN),制备得到3D-AlN/EP复合材料。SEM形貌和XRD物相表征结果证实3D-AlN骨架及3D-AlN/EP复合材料的成功制备。利用TGA精确测量3D-AlN骨架所占复合材料的质量分数,通过与含有不同含量随机分布的AlN/EP (Random AlN/EP)复合材料对比发现,3D-AlN/EP复合材料的导热系数要高于Random AlN/EP复合材料,45.48wt%3D-AlN/EP复合材料的室温(25℃)导热系数为1.00 W/(m·K),是纯EP(0.18 W/(m·K))的5.6倍。利用理论模型(Fogyel、Agari)计算复合材料的界面热阻,发现3D-AlN/EP复合材料相比于Random AlN/EP具有更低的填料与填料间界面热阻,分别为2.704×105 K·W−1、4.019×105 K·W−1。电性能测试结果表明,45.48wt%3D-AlN/EP复合材料具良好的介电性能及绝缘性能(体积电阻率为4.16×1011 Ω·cm)。本研究从封装绝缘材料改性角度为电子器件散热问题提供了一种有效解决方案。

     

  • 图  1  三维多孔的氮化铝骨架(3D-AlN)骨架及3D-AlN/环氧树脂(EP)的制备示意图

    Figure  1.  Schematic diagram of the preparation of three-dimensional porous aluminum nitride skeleton (3D-AlN) framework and 3D-AlN/epoxy resin (EP) composites

    APG—Alkyl polyglucoside

    图  2  (a) 3D-AlN骨架的SEM图像;(b) 图2(a)的局部放大SEM图像;(c) 3D-AlN/EP复合材料的SEM图像;((d), (e)) 对于图2(c)的能谱及元素分布

    Figure  2.  (a) SEM image of 3D-AlN framework; (b) Partially enlarged SEM image according to Fig. 2(a); (c) SEM image of 3D-AlN/EP composite; ((d), (e)) Energy spectrum and element distribution according to Fig. 2(c), respectively

    图  3  (a) 3D-AlN/EP复合材料的TGA曲线;(b) AlN和3D-AlN/EP复合材料的XRD图谱

    Figure  3.  (a) TGA curves of 3D-AlN/EP composites; (b) XRD patterns of AlN and 3D-AlN/EP composites

    图  4  (a) 不同3D-AlN含量的随机分布AlN/EP及3D-AlN/EP复合材料的导热系数及Foygel非线性拟合;(b) Agari模型线性拟合;(c) 不同3D-AlN含量3D-AlN/EP复合材料导热系数随温度变化的曲线;(d) 不同3D-AlN含量3D-AlN/EP复合材料的DSC图谱

    Figure  4.  (a) Thermal conductivity and Foygel nonlinear fit of randomly distributed AlN/EP and 3D-AlN/EP composites with different contents of 3D-AlN; (b) Linear fit of Agari model; (c) Thermal conductivity curves of 3D-AlN/EP composites with different contents of 3D-AlN as a function of temperature; (d) DSC spectra of 3D-AlN/EP composites with different contents of 3D-AlN

    Cf—Ability of the filler to form continuity; Cm—Effect of the filler on the structure of the matrix; λ—Thermal conductivity of composites

    图  5  (a) 不同3D-AlN含量3D-AlN/EP复合材料的红外热成像照片;((b), (c)) 随机分布AlN/EP和3D-AlN/EP复合材料的固体传热仿真结果

    Figure  5.  (a) Infrared thermal images of 3D-AlN/EP composites with different contents of 3D-AlN; ((b), (c)) Solid heat transfer simulation results of random AlN/EP and 3D-AlN/EP composites

    图  6  不同3D-AlN含量3D-AlN/EP复合材料的介电常数 (a) 和介电损耗随频率变化图谱 (b)

    Figure  6.  Permittivity (a) and loss tangent (b) of 3D-AlN/EP composites with different contents of 3D-AlN as a function of frequency

    图  7  不同3D-AlN含量3D-AlN/EP复合材料的体积电阻率

    Figure  7.  Volume resistivity of 3D-AlN/EP composites with different contents of 3D-AlN

    表  1  随机分布的AlN/EP和3D-AlN/EP复合材料的参数计算结果

    Table  1.   Calculation results of parameters for Random AlN/EP and 3D-AlN/EP composites

    CompositesK0Vc/vol%βRc/(105 K·W−1)
    Random AlN/EP3.4120.09940.833924.019
    3D-AlN/EP3.6150.05970.562962.704
    Notes: K0—Pre-exponential factor; Vc—Critical volume fraction of filler; β—Conductivity exponent that depends on the aspect of filler; Rc—Interface thermal resistance.
    下载: 导出CSV
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出版历程
  • 收稿日期:  2022-07-12
  • 修回日期:  2022-08-29
  • 录用日期:  2022-08-29
  • 网络出版日期:  2022-09-06
  • 刊出日期:  2023-06-15

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