高性能双组分有机硅灌封胶的研究进展

赵宏岩; 何振培; 白高翔; 李云峰; 丁适跃; 邵向东; 李剑浩; 余建华; 周青; 杨雷

高性能双组分有机硅灌封胶的研究进展

赵宏岩¹,
何振培¹,
白高翔¹,
李云峰²,
丁适跃²,
邵向东³,
李剑浩²,
余建华²,
周青^{1, 4, ,},
杨雷^{1, 4}

1.
浙江理工大学, 杭州 310018
2.
浙江科峰有机硅股份有限公司, 海宁 314400
3.
衢州科峰新材料有限公司, 衢州, 324000
4.
浙江理工大学绍兴柯桥研究院有限公司, 绍兴, 312000

基金项目: 浙江省“尖兵”“领雁”项目 (2023C01103)；浙江理工大学绍兴柯桥研究院有限公司项目(2023330001000823-J)

详细信息

通讯作者:
周青，博士，副教授，硕士生导师，研究方向为有机硅新材料　E-mail: qingzhou1@zstu.edu.cn

中图分类号: TB332
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- 文章访问数: 60
- HTML全文浏览量: 23
- 被引次数: 0
出版历程
- 收稿日期: 2024-06-17
- 修回日期: 2024-08-20
- 录用日期: 2024-08-25
- 网络出版日期: 2024-09-04

Research progress of high performance two-component silicone potting adhesive

1.
Zhejiang Sci-Tech University, Hangzhou 310018
2.
Zhejiang Kefeng silicone Co., Ltd., Haining 314400
3.
Quzhou Kefeng New Material Co., Ltd., Quzhou 324000
4.
Shaoxing Keqiao Research Institute Co., Ltd. of Zhejiang Sci-Tech University, Shaoxing 312000

Funds: JianBing” “LingYan” Project of Zhejiang Province (2023C01103)；Project of Shaoxing Ke Qiao Research Institute Co., Ltd. of Zhejiang Sci-Tech University (2023330001000823-J)

摘要

摘要: 随着工业技术的发展，对封装材料如高性能双组分有机硅灌封胶的需求日益增长，尤其是在航空航天、电子电气及汽车工业中，其优异的电气绝缘性、热稳定性及化学惰性使得它成为研究热点。本文综述了高性能双组分有机硅灌封胶的制备方法、固化机制与性能表征，重点对比了国内外在该领域的最新进展。通过对近年来发表的文献的系统分析和整理，揭示了目前双组分灌封胶性能提升的关键因素及影响机制，为制备高性能的此类材料提供了趋势借鉴。本文发现，通过纳米填料的加入和交联密度的优化，可显著增强灌封胶的综合性能。综合考虑性能与成本后，本文提出了灌封胶未来研究的方向和潜在的应用前景，希望为相关领域的学术研究与工业应用提供有益的参考。
- 有机硅灌封胶 /
- 双组分体系 /
- 固化机制 /
- 性能表征 /
- 纳米填料
Abstract: With the development of industrial technology, the demand for packaging materials such as high-performance two-component silicone potting adhesives is growing, especially in the aerospace, electronic and electrical and automotive industries. Its excellent electrical insulation, thermal stability and chemical inertness make it a research hotspot. In this paper, the preparation, curing mechanism and characterization of high performance two-component silicone potting adhesives were reviewed, with emphasis on the latest progress in this field at home and abroad. Through systematic analysis and collation of the literature published in recent years, the key factors and influencing mechanism of improving the performance of two-component potting adhesives were revealed, which provided a trend for the preparation of such materials with high performance. It was found that the comprehensive properties of potting adhesives could be significantly enhanced by the addition of nano-fillers and the optimization of crosslinking density. After considering the performance and cost comprehensively, this paper puts forward the future research direction and potential application prospect of potting adhesive, hoping to provide useful reference for academic research and industrial application in related fields.
- Silicone potting compounds /
- Two-component systems /
- Curing mechanisms /
- Performance characterization /
- Nano-fillers

HTML全文

图 1 有机硅灌封胶种类

Figure 1. Silicone encapsulant type

下载: 全尺寸图片幻灯片

图 2 LED驱动电源

Figure 2. LED drive power

下载: 全尺寸图片幻灯片

图 3 装了灌封胶的LED驱动电源

Figure 3. LED drive power containing encapsulant

下载: 全尺寸图片幻灯片

图 4 不同交联剂用量下有机硅密封胶的硫化深度

Figure 4. Curing depth of silicone sealant at different crosslinker dosages

下载: 全尺寸图片幻灯片

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