Thermal conductivity and electrical insulating properties of epoxy composites mixed with boron nitride and zinc oxide whisker
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摘要: 双酚A环氧树脂(EP)因其具有优异电绝缘性能而被广泛应用于电子器件中，但EP的热导率较低，通过填充高导热无机填料而构建导热通路是当前提高聚合物复合材料热导率的有效策略。本文综合利用溶液共混与热压工艺制备得到了六方氮化硼(h-BN)-四针状氧化锌晶须(T-ZnOw)/EP复合材料，并对复合材料的微观形貌与物相结构、导热性能及绝缘性能进行了系统表征与分析。结果表明，复合填充h-BN-T-ZnOw/EP复合材料兼具良好的导热性和绝缘性，当h-BN-T-ZnOw的填充含量为30wt%/5wt%时，25℃下热导率为0.55 W/(m·K)，相比于纯EP提升了2.9倍，同时复合材料体积电阻率大于1015 Ω·m，表现出良好的绝缘性。Abstract: Phenolic epoxy resin (EP) is widely used in electronics because of its excellent electrical insulating pro-perties. The thermal conductivity of EP is low, and filling the highly conductive thermal inorganic fillers is an effec-tive way to construct the thermal conductive pathway of the thermal transport frame to improve the thermal conductivity of polymer composites. In this paper, the hexagonal boron nitride (h-BN)-four needle zinc oxide whisker (T-ZnOw)/EP composite was prepared by solution blended and hot-compaction process. The microstructures aspects, phase structures, thermal conductivity and electric insulating propertis of composites were systematically characterized and analyzed. The results show the h-BN-T-ZnOw/EP composite has good thermal conductivity and electrical insulating properties. When h-BN-T-ZnOw loading is 30wt%/5wt%, the thermal conductivity at 25℃ is 0.55 W/(m·K), which is 2.9 times higher than that of EP, and its volume resistivity is greater than 1015 Ω·m.
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图 1 环氧树脂(EP)基复合材料的制备流程图
Figure 1. Preparation process of epoxy resin (EP)-based composites
h-BN—Hexagonal boron nitride; T-ZnOw—Four needle zinc oxide whisker
图 2 六方氮化硼(h-BN)和四针状氧化锌晶须(T-ZnOw)无机填料的微观结构表征
Figure 2. Microstructural aspects of with hexagonal boron nitride (h-BN) and four needle zinc oxide whisker (T-ZnOw) inorganic fillers (((a), (b)) SEM images of h-BN; (c) TEM image of h-BN; (d) SEM image of T-ZnOw)
图 3 h-BN/EP和h-BN-T-ZnOw/EP复合材料断面形貌结构SEM图像
Figure 3. SEM images of the section appearance with h-BN/EP and h-BN-T-ZnOw/EP composites ((a) EP; (b) 10wt%h-BN; (c) 20wt%h-BN; (d) 30wt%h-BN; (e) 10wt%h-BN-5wt%T-ZnOw; ((f), (g)) 20wt%h-BN-5wt%T-ZnOw; ((h), (i)) 30wt%h-BN-5wt%T-ZnOw)
图 4 30wt%h-BN-5wt%T-ZnOw/EP断面元素分布图
Figure 4. Element map of the section with 30wt%h-BN-5wt%T-ZnOw/EP ((a) SEM image of 30wt%h-BN-5wt%T-ZnOw/EP; ((b)-(e)) Distribution of B, N, O, Zn, respectively)
图 5 h-BN/EP和h-BN-T-ZnOw/EP复合材料的XRD图谱
Figure 5. XRD patterns of h-BN/EP and h-BN-T-ZnOw/EP composite
图 6 h-BN/EP和h-BN-T-ZnOw/EP复合材料的导热系数
Figure 6. Thermal conductivity of h-BN/EP and h-BN-T-ZnOw/EP composite
图 7 h-BN/EP和h-BN-T-ZnOw/EP复合材料的介电特性
Figure 7. Dielectric property of h-BN/EP and h-BN-T-ZnOw/EP composite
图 8 h-BN/EP和h-BN-T-ZnOw/EP复合材料在不同温度下的体积电阻率
Figure 8. Volume resistivity of h-BN/EP and h-BN-T-ZnOw/EP composite at variable temperature
图 9 h-BN/EP与h-BN-T-ZnOw/EP复合材料在不同电场强度下的累计击穿概率
Figure 9. Cumulative breakdown probability at different electric strength of h-BN/EP and h-BN-T-ZnOw/EP composite
α—Scale parameter, breakdown field strength when the breakdown probability is 63.2%; β—Shape parameter, breakdown data dispersion
图 10 h-BN/EP与h-BN-T-ZnOw/EP复合材料的击穿场强
Figure 10. Breakdown strength of h-BN/EP and h-BN-T-ZnOw/EP composite
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