碳化硅颗粒增强石墨/铝复合材料的热物理性能

曾凡坤; 孟正华; 郭巍

doi:10.13801/j.cnki.fhclxb.20211103.004

碳化硅颗粒增强石墨/铝复合材料的热物理性能

doi: 10.13801/j.cnki.fhclxb.20211103.004

曾凡坤^{1, 2},
孟正华^{1, 2},
郭巍^{1, 2, ,}

1.
武汉理工大学　现代汽车零部件技术湖北省重点实验室，武汉 430070
2.
武汉理工大学　汽车零部件技术湖北省协同创新中心，武汉 430070

基金项目: 国家自然科学基金青年基金(51605356)

详细信息

通讯作者:
郭巍，博士，副教授，博士生导师，研究方向为汽车轻量化材料　E-mail: whutgw@whut.edu.cn

中图分类号: TB333
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- 被引次数: 0
出版历程
- 收稿日期: 2021-08-24
- 修回日期: 2021-10-19
- 录用日期: 2021-10-28
- 网络出版日期: 2021-11-04
- 刊出日期: 2022-08-22

Thermophysical properties of SiC particles reinforced graphite flakes/Al composites

ZENG Fankun^{1, 2},
MENG Zhenghua^{1, 2},
GUO Wei^{1, 2
, ,}

1.
Hubei Key Laboratory of Advanced Technology for Automotive Components, Wuhan University of Technology, Wuhan 430070, China
2.
Hubei Collaborative Innovation Center for Automotive Components Technology, Wuhan University of Technology, Wuhan 430070, China

摘要

摘要: 片层石墨/铝复合材料具有低密度、高热导率的优点，但力学性能较差，目前无法作为一种可商业化应用的电子封装材料。为了改善片层石墨/铝复合材料的热物理性能，采用真空热压法制备了碳化硅颗粒增强石墨/铝复合材料，研究了碳化硅的含量对复合材料热导率、热膨胀系数和抗弯强度的影响。结果表明，经过高频振荡工艺，碳化硅-石墨/铝复合材料中石墨的排列取向良好。添加碳化硅颗粒能明显降低复合材料的热膨胀系数，提高抗弯强度，略微降低热导率。随着碳化硅颗粒体积分数增加，碳化硅-石墨/铝复合材料内部会逐渐出现孔洞缺陷，相对密度下降。当碳化硅和石墨的体积分数分别为15vol%、50vol%时，碳化硅-石墨/铝复合材料具有最优热物理性能，此时x-y方向热导率为536 W/(m·K)、热膨胀系数为6.4×10⁻⁶ m/K，抗弯强度为102 MPa，是一种十分具有商业前景的电子封装材料。
- 碳化硅-石墨/铝 /
- 热导率 /
- 热膨胀系数 /
- 抗弯强度 /
- 复合材料
Abstract: The graphite flakes/Al composite has the advantages of low density and high thermal conductivity, but it cannot be used as a kind of commercial electronic packaging material due to its poor mechanical properties at present. In order to improve the thermophysical properties of graphite flakes/Al composite, the SiC particles reinforced graphite flakes/Al composites were prepared via vacuum hot-pressing process. The effect of the different content of SiC on the thermal conductivity, coefficient of thermal expansion, and flexure strength of the SiC-graphite flakes/Al composites were studied. The result shows that the high-frequency vibration process contributes to the good orientation of graphite flakes in the composites. The SiC particles can significantly reduce the coefficient of thermal expansion, increase the flexure strength, and slightly decrease the thermal conductivity of the composites. However, as the volume fraction of SiC particles increases, many pores and defects are gradually foamed in the SiC-graphite flakes/Al composites, causing the decrease of the relative density. When the volume fraction of SiC and graphite flakes are 15vol% and 50vol%, respectively, the thermal conductivity in x-y plane, coefficient of thermal expansion and flexure strength of the SiC-graphite flakes/Al composite are 536 W/(m·K) and 6.4×10^-6 m/K and 102 MPa, respectively, exhibiting the best comprehensive thermophysical properties, which can be a kind of electronic packaging material with very commercial prospect.
- SiC-graphite flakes/Al /
- thermal conductivity /
- coefficient of thermal expansion /
- flexure strength /
- composite

HTML全文

图 1 SiC-GFs/Al复合材料的微观形貌：(a) 60vol%GFs/40vol%Al; (b) 20vol%SiC-40vol%GFs/40vol%Al; (c) T1区域; (d) T2区域

Figure 1. Microstructure of SiC-GFs/Al composites: (a) 60vol%GFs/40vol%Al; (b) 20vol%SiC-40vol%GFs/40vol%Al; (c) T1 zone; (d) T2 zone

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图 2 不同SiC及GFs添加量的SiC-GFs/Al复合材料的相对密度

Figure 2. Relative density of the SiC-GFs/Al composites with different contents of SiC and GFs

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图 3 不同SiC及GFs添加量的SiC-GFs/Al复合材料的热导率：(a) x-y方向；(b) z方向

Figure 3. Thermal conductivity of the SiC-GFs/Al composites with different contents of SiC and GFs: (a) In x-y plane; (b) In z plane

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图 4 SiC-GFs/Al复合材料内部热流传递示意图

Figure 4. Schematic illustration of heat flux in the SiC-GFs/Al composites

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图 5 不同SiC及GFs添加量的SiC-GFs/Al复合材料的热膨胀系数：(a) x-y方向；(b) z方向

Figure 5. Coefficient of thermal expansion of the SiC-GFs/Al composites with different contents of SiC and GFs: (a) In x-y plane; (b) In z plane

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图 6 SiC-GFs/Al复合材料的断口形貌：((a), (b)) 50vol%GFs/50vol%Al；((c), (d)) 10vol%SiC-50vol%GFs/40vol%Al

Figure 6. Fracture morphologies of SiC-GFs/Al composites: ((a), (b)) 50vol%GFs/50vol%Al; ((c), (d)) 10vol%SiC-50vol%GFs/40vol%Al

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图 7 (a)不同SiC及GFs添加量的SiC-GFs/Al复合材料的抗弯强度；(b)不同Al基复合材料抗弯强度和热导率的对比

Figure 7. (a) Flexure strength of the SiC-GFs/Al composites with different contents of SiC and GFs; (b) Comparison of flexure strength and thermal conductivity of different Al matrix composites

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表 1 不同碳化硅-石墨/铝(SiC-GFs/Al)复合材料中碳化硅和石墨的体积分数

Table 1. Volume fractions of SiC and GFs in SiC-graphite flakes/Al (SiC-GFs/Al) composites

No	SiC/vol%	GFs/vol%	Al/vol%
1	0	40	60
2	5	40	55
3	10	40	50
4	15	40	45
5	20	40	40
6	0	50	50
7	5	50	45
8	10	50	40
9	15	50	35
10	20	50	30
11	0	60	40
12	5	60	35
13	10	60	30
14	15	60	25
15	20	60	20

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表 2 碳化硅、石墨和铝的物理参数

Table 2. Physical parameters of SiC, GFs and Al

Materials	ρ/(kg·m⁻³)	C_p/ (J·(kg·K)⁻¹)	TC/ (W·(m·K)⁻¹)		CTE/ (10⁻⁶ m·K⁻¹)
SiC^[19]	3210	290	248		4.6
GFs^[20-21]	2260	710	1000^x-y	38^z	−1.5^x-y	25^z
Al^[22]	2700	895	237		23.5
Notes: ρ—Density of the materials; C_p—Specific heat; TC—Thermal conductivity; CTE—Coefficient of thermal expansion; Superscripts “x-y” and “z”—Direction parallel and perpendicular to the GFs (002) crystal plane.

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