Preparation and thermally conductive properties of functionalized boron nitride nanosheets/polyurethane composites with double heat-conduction networks
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摘要: 研发低填充且高导热的聚合物基导热复合材料是目前亟需解决的瓶颈问题。基于层层氢键组装,以聚氨酯(PU)开孔泡沫为模板,以聚多巴胺功能化改性氮化硼纳米片(BNNS@PDA)为导热填料,采用浸涂-热压成型法制得低填充、高导热BNNS@PDA/PU复合材料。深入研究了BNNS@PDA和BNNS@PDA/PU复合材料的微观结构、导热性能和热稳定性等。结果表明,通过聚多巴胺(PDA)对BNNS进行表面功能化改性能够使其良好地负载于PU开孔泡沫的三维骨架表面。通过热压成型形成以PU骨架为主要导热网络、以PU骨架表面包覆的BNNS@PDA为次级导热网络的高效双重三维导热网络结构,从而降低导热复合材料的界面热阻。当BNNS@PDA填充量为16.3wt%时,双导热网络BNNS@PDA/PU复合材料的热导率达到0.783 W/(m·K),与单导热网络PU的热导率(0.387 W/(m·K))相比提高了102.3%。Abstract: The development of polymer-based thermally conductive composites with low filling and high thermally conductivity remains a bottleneck problem that needs to be solved. Based on the layer-by-layer hydrogen-bond assembly, the low filling and high thermally conductive BNNS@PDA/PU composites are prepared by the dip coating-hot pressing method, using the porous polyurethane (PU) foams as template, and polydopamine functionalized nitride boron nanosheets (BNNS@PDA) as thermally conductive fillers. The microstructures, thermal conductive properties and thermal stability of BNNS@PDA and BNNS@PDA/PU composites were investigated in detail. The results show that the surface functionalization of BNNS by PDA can make it coat well on the three-dimensional skeleton of porous PU foams. After hot pressing, the highly effective double heat-conduction networks with the PU skeleton as the main heat-conduction network and BNNS@PDA on the surface of PU skeleton as the secondary heat-conduction network are constructed, leading to the decreased interfacial thermal resistance of the thermally conductive composites. When the filling amount of BNNS@PDA is 16.3wt%, the thermal conductivity of BNNS@PDA/PU composites with double heat-conduction networks reaches 0.783 W/(m·K), which is 102.3% higher than that of PU with single heat-conduction network (0.387 W/(m·K)).
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图 3 (a) BN、BNNS、BNNS@PDA、PU开孔泡沫和BNNS@PDA/PU复合材料的FTIR图谱;(b) BN、BNNS和BNNS@PDA的XRD图谱;BNNS和BNNS@PDA的XPS图谱 (c) 和TGA曲线 (d)
Figure 3. (a) FTIR spectras of BN, BNNS, BNNS@PDA, porous PU foams and BNNS@PDA/PU composites; (b) XRD patterns of BN, BNNS and BNNS@PDA; XPS spectras (c) and TGA curves (d) of BNNS and BNNS@PDA
图 4 PU开孔泡沫的数码照片 (a) 和SEM图像 (a') 及单导热网络PU材料的SEM图像 (a'');BNNS@PDA/PU复合泡沫数码照片 (b)、SEM图像 (b') 和B元素EDS分布图像 (b'');BNNS@PDA/PU复合材料数码照片 (c) 和断面SEM图像 ((c'), (c''))
Figure 4. Digital photo (a) and SEM image of porous PU foams (a') and SEM image of PU with single heat-conduction network (a''); Digital photo (b), SEM image (b') and EDS mapping image of B (b'') of BNNS@PDA/PU composite foams; Digital photo (c), SEM images ((c'), (c'')) of BNNS@PDA/PU composites
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