Abstract: In recent years, with the rapid development of fields related to semiconductor technology, such as electronic components, sensors and integrated circuits, the requirements for heat dissipation have become increasingly demanding. Hexagonal Boron Nitride(h-BN) is an excellent insulating and thermally conductive material, which is widely used in the composite process with polymer materials. Therefore, how to achieve the optimal performance presentation during the compounding process of h-BN and polymers has become the core topic that many scholars focus on. The article briefly introduced the thermal conductivity mechanism of h-BN and the factors that influence its thermal conductivity, explained the impact of the distribution of h-BN in polymers on the properties of composite materials, and focused on reviewing the research progress of three-dimensional network hexagonal boron nitride/polymer composite materials. Finally,it summarized some of the current technical difficulties and looked forward to the future development directions.