复合电铸制备Ni-石墨复合材料工艺及其沉积机理

赵海军, 刘磊, 朱建华, 沈彬, 胡文彬

赵海军, 刘磊, 朱建华, 等. 复合电铸制备Ni-石墨复合材料工艺及其沉积机理[J]. 复合材料学报, 2005, 22(3): 92-97.
引用本文: 赵海军, 刘磊, 朱建华, 等. 复合电铸制备Ni-石墨复合材料工艺及其沉积机理[J]. 复合材料学报, 2005, 22(3): 92-97.
ZHAO Haijun, LIU Lei, ZHU Jianhua, et al. COMPOSITE ELECTROFORMING TECHNOLOGY OFFABRICATING NICKEL-GRAPHITE COMPOSITES[J]. Acta Materiae Compositae Sinica, 2005, 22(3): 92-97.
Citation: ZHAO Haijun, LIU Lei, ZHU Jianhua, et al. COMPOSITE ELECTROFORMING TECHNOLOGY OFFABRICATING NICKEL-GRAPHITE COMPOSITES[J]. Acta Materiae Compositae Sinica, 2005, 22(3): 92-97.

复合电铸制备Ni-石墨复合材料工艺及其沉积机理

基金项目: 国家高技术研究发展计划(“863”计划) 项目(2002AA334010); 上海市科委重点新材料项目(035211037); 上海市科技发展基金项目(0211nm052)
详细信息
    通讯作者:

    胡文彬,教授,主要从事复合电沉积及材料表面改性等研究 E-mail:wbhu@263.net

  • 中图分类号: TB331

COMPOSITE ELECTROFORMING TECHNOLOGY OFFABRICATING NICKEL-GRAPHITE COMPOSITES

  • 摘要: 采用复合电铸技术制备了Ni-石墨自润滑复合材料, 重点研究了工艺参数(微粒浓度、电流密度、电铸液流动速度及温度和p H 值) 对复合材料中石墨微粒含量的影响。结果表明, 提高镀液中微粒浓度使复合材料中石墨含量增大, 最后趋于稳定值。电流密度和镀液流动速度使石墨含量存在最大值, 但是温度和p H 值的增加却使之降低。复合电铸沉积机理Guglielmi 模型只在低电流密度条件下适用, 但不适用于高电流密度的条件。镀液中石墨微粒含量增大, 复合材料的硬度和摩擦系数降低, 磨损失重减小, 但是石墨微粒30 g/ L 时的磨损量增加。
    Abstract: The process of the elect rolytic codeposition of nickel-graphite in nickel sulfamate solution was investigated. The result s show that the plating variables have different influence on the volume f raction of graphite particlesin elect rodeposited composites. The volume f raction of graphite incorporated in deposit increases with increasingconcent ration of suspended particles in solution, and then remains constant . There are maximums related to the current density and flow velocity, while temperature and p H values exert an adverse effect . Guglielmi’s model can beused at low current densities for the composite elect roforming system. The microhardness and friction coefficient ofNi-graphite composites decrease with increasing particle concent ration in solution. The wear mass loss also decreases, but it increases at the graphite concent ration of 30 g/ L.
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出版历程
  • 收稿日期:  2004-07-01
  • 修回日期:  2004-12-26
  • 刊出日期:  2005-06-14

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