聚乙烯/碳纤维复合材料的制备及其各向异性传导行为

Preparation and anisotropic conduction behavior of polyethylene/carbonfiber composites

  • 摘要: 各向异性传导高分子复合材料(ACPC)因其独特的各向异性导电、导热等特性在集成电路、传感器件、热管理等领域具有巨大的应用潜力。本文以碳纤维(CF)和高密度聚乙烯(HDPE)膜为原料,碳纤维经高温预处理后,通过超声分散和真空抽滤工艺制备三维碳纤维网络,再采用热压成型技术将其与聚乙烯膜复合制备具有各向异性传导行为的HDPE/CF复合材料。通过DSC、SEM、TG及导电性能测试研究了复合材料的微结构、热性质和电性能,采用集成电路和红外热像仪对复合材料的各向异性传导行为进行监测。聚乙烯层与碳纤维网层交替排列且结合紧密;这种交替多层结构赋予了HDPE/CF复合材料层内导电、层间绝缘特性,呈现典型的各向异性传导行为。HDPE/CF复合材料在X方向和Y方向具有优异的导电性能(电导率高达85.71 S/m),高出Z方向5~7个数量级。交替多层结构和碳纤维网的引入显著提高了HDPE/CF复合材料的热稳定性能,其初始热分解温度相对HDPE膜提高了约35℃。该复合材料具有优异的电子载流能力和定向传导能力,在电路连接、定向导电、热管理等领域具有巨大的应用潜力。

     

    Abstract: The anisotropic conductive polymer composites (ACPCs) have great application potential in integrated circuits, sensors, thermal management and other fields because of their unique anisotropic conductive and thermal properties. In this experiment, the carbon fiber (CF) and high-density polyethylene (HDPE) films were used as raw materials. The CF was pretreated at high temperature firstly and then used to make a carbon fiber network by ultrasonic dispersion and vacuum filtration technology. Subsequently, the HDPE/CF composites with anisotropic conductivity were fabricated by hot-pressing molding technique. DSC, SEM, TG and conductivity tests were performed to analyze the microstructure, thermal and conductive properties of composites. Then the anisotropic conduction behavior of HDPE/CF was monitored by the integrated circuits and IR thermal camera. HDPE layer and CF web layer are arranged alternately and closely combined. The alternating multilayer structure endows HDPE/CF composites with special intra layer conductivity and interlayer insulation, showing typical anisotropic conductivity. HDPE/CF composites exhibit excellent electrical conductivity in the X and Y directions (with conductivity up to 85.71 S/m), which is 5-7 orders of magnitude higher than the Z direction. The introduction of alternating multilayer structure and CF web significantly improves the thermal stability of HDPE/CF composite, and its initial thermal decomposition temperature is increased by about 35℃ compared with that of HDPE film. It exhibits excellent current-carrying capability and remarkable conductive anisotropy, exhibiting great application potential in circuit connection, directional conduction, thermal management and other fields.

     

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