ZHEN Wen, TAI Feng, GUO Fu. Welding characterization of polyhedral oligomeric silsesquioxane particles reinforced Sn-Ag based composite solder[J]. Acta Materiae Compositae Sinica, 2014, 31(1): 166-170.
Citation: ZHEN Wen, TAI Feng, GUO Fu. Welding characterization of polyhedral oligomeric silsesquioxane particles reinforced Sn-Ag based composite solder[J]. Acta Materiae Compositae Sinica, 2014, 31(1): 166-170.

Welding characterization of polyhedral oligomeric silsesquioxane particles reinforced Sn-Ag based composite solder

  • Received Date: 2013-02-25
  • Rev Recd Date: 2013-09-17
  • Publish Date: 2014-02-15
  • Nano-sized polyhedral oligomeric silsesquioxane-TriSilanol cyclohexyl (POSS) particulates reinforced Sn-3.5Ag composite solder joint could improve mechanical reliability. The 3% fraction of POSS reinforcement is the best weight fraction. The welding characterization of POSS reinforcement in 3% POSS/Sn-Ag composite solder was analyzed through differential scanning calorimeter (DSC) analysis based on former experimental results in this paper. Results indicate that the welding temperature of 3% POSS/Sn-Ag composite solder is similar to that of Sn-3.5Ag eutectic solder, so 3% POSS/Sn-Ag composite solder has acceptable processing property. In addition, according to DSC analysis, 3% POSS/Sn-Ag composite solder has higher activation energy. It demonstrates that POSS reinforcements might be present in the Sn boundaries.

     

  • loading
  • 加载中

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Article Metrics

    Article views (629) PDF downloads(572) Cited by()
    Proportional views
    Related

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return