LI Chongling, LI Yueming, LI Haibo, et al. Modal evolution of composite typical panel structure considering thermal effects[J]. Acta Materiae Compositae Sinica, 2018, 35(4): 936-945. doi: 10.13801/j.cnki.fhclxb.20170705.002
Citation: LI Chongling, LI Yueming, LI Haibo, et al. Modal evolution of composite typical panel structure considering thermal effects[J]. Acta Materiae Compositae Sinica, 2018, 35(4): 936-945. doi: 10.13801/j.cnki.fhclxb.20170705.002

Modal evolution of composite typical panel structure considering thermal effects

doi: 10.13801/j.cnki.fhclxb.20170705.002
  • Received Date: 2017-04-18
  • Publish Date: 2018-04-15
  • A thermal modal analysis method was established by considering the effects of material property's change, thermal stress and deformation to investigate thermal modal evolution of composite stiffened and connecting plates. The calculation results show that material property's change and thermal stress result in the increasing in modal frequencies under thermal buckling temperature. In post-buckling stage, the nonlinear deformation can increase the stiffness of panel structures, which makes the modal frequencies increase. Mode changes occur during the whole warming-up process and modals tend to be dense; Initial deflections, size of stiffeners and reinforcement patterns have great influence on the critical buckling temperature of stiffened plates. Mode shapes are also changed and appear characteristics of localized. For connecting plates, due to the similarity of thermal deformation and modal shape, the modal frequency will jump from the lower order to the higher.

     

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      沈阳化工大学材料科学与工程学院 沈阳 110142

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