Preparation and properties of SiC<sub>P</sub>-SiC<sub>W</sub> hybrid fillers/bismaleimide thermal conductivity composites

DANG Jing; LIU Tingting

doi:10.13801/j.cnki.fhclxb.20160328.002

Volume 34 Issue 2

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DANG Jing, LIU Tingting. Preparation and properties of SiCP-SiCW hybrid fillers/bismaleimide thermal conductivity composites[J]. Acta Materiae Compositae Sinica, 2017, 34(2): 263-269. doi: 10.13801/j.cnki.fhclxb.20160328.002

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DANG Jing, LIU Tingting. Preparation and properties of SiC_P-SiC_W hybrid fillers/bismaleimide thermal conductivity composites[J]. Acta Materiae Compositae Sinica, 2017, 34(2): 263-269. doi: 10.13801/j.cnki.fhclxb.20160328.002

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Preparation and properties of SiC_P-SiC_W hybrid fillers/bismaleimide thermal conductivity composites

doi: 10.13801/j.cnki.fhclxb.20160328.002

DANG Jing^1
,,
LIU Tingting²

1.
Standard Process Material Research Institute, AVIC the First Aircraft Institute, Shaanxi Yanliang, 710089, China;
2.
The Second Artillery Command College, Wuhan, 430012, China

Received Date: 2016-02-22
Rev Recd Date: 2016-03-11
Publish Date: 2017-02-15

Abstract

Abstract

Functionalized SiC particle-SiC whisker (SiC_P-SiC_W) hybrid fillers by γ-glycidoxypropyltrimethoxysilane (KH-560) were performed to fabricate the functionalized SiC_P-SiC_W/bismaleimide (SiC_P-SiC_W/BMI) thermal conductivity composites,BMI as the polymeric matrix and diallylbisphenol A (DABA) as a toughening agent,respectively.Effects of the shape,content,compound and surface functionalization of SiC fillers on the thermal conductivities,dielectric & mechanical properties and thermal stabilities of the functionalized SiC_P-SiC_W/BMI thermal conductivity composites were investigated.The results show that the functionalized SiC_P-SiC_W/BMI thermal conductivity composite with 40wt% functionalized SiC_P-SiC_W(1:3,mass ratio) hybrid fillers exhibits the best comprehensive performance,the corresponding thermally conductive coefficient λ of 1.125 W (m·K)^-1,dielectric constant ε of 4.12,and 5wt% thermal mass loss temperature of 427℃.
- bismaleimide,
- diallylbisphenol A,
- SiC_P,
- SiC_W,
- thermal conductivity composites
Long Abstrsct
Innovation Points