XU Yusong, LI Peng, JIN Cuiping. Preparation of Si3N4 in-situ reinforced Cu matrix composites[J]. Acta Materiae Compositae Sinica, 2015, 32(2): 458-464. doi: 10.13801/j.cnki.fhclxb.20140418.001
Citation: XU Yusong, LI Peng, JIN Cuiping. Preparation of Si3N4 in-situ reinforced Cu matrix composites[J]. Acta Materiae Compositae Sinica, 2015, 32(2): 458-464. doi: 10.13801/j.cnki.fhclxb.20140418.001

Preparation of Si3N4 in-situ reinforced Cu matrix composites

doi: 10.13801/j.cnki.fhclxb.20140418.001
  • Received Date: 2014-01-02
  • Rev Recd Date: 2014-04-03
  • Publish Date: 2015-04-15
  • Cu-Si alloy powder was prepared by induction furnace melting and water atomization process, and the Si3N4 in-situ reinforced Cu matrix composites (Si3N4/Cu) were prepared after gas mixture of N2 and H2 selective nitriding and vacuum spark plasma sintering (SPS) forming. The selective nitriding product and its crystalline structure were investigated by extraction method. Results show that nitrogen content of composite powder rises with the increase of nitriding temperature and extension of nitriding time. The nitrogen content significantly increases after nitriding for more than 60 h under 1 000 ℃. Overall diffraction peaks of Cu apparently move to the big angle, and the lattice constant decreases at the same time, which suggest that Si exsolves from Cu matrix to form Si3N4 while reacts with N. The reinforcement in Si3N4/Cu composites is mainly β-Si3N4. With nitriding temperature and time increasing, the electrical conductivity and hardness of Si3N4/Cu composites gradually increase.

     

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      沈阳化工大学材料科学与工程学院 沈阳 110142

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