MAH-GO/MBMI-E51复合材料的微观结构及力学性能

陈宇飞; 赵辉; 滕成君

doi:10.13801/j.cnki.fhclxb.20210419.002

MAH-GO/MBMI-E51复合材料的微观结构及力学性能

doi: 10.13801/j.cnki.fhclxb.20210419.002

陈宇飞^{1, 2, ,},
赵辉^1,,
滕成君³

1.
哈尔滨理工大学　材料科学与工程学院，哈尔滨 150040
2.
哈尔滨理工大学　工程电介质及应用技术教育部重点实验室，哈尔滨 150080
3.
哈尔滨市香坊区疾病控制中心，哈尔滨 150030

基金项目: 哈尔滨创新人才专项(2015RAXXJ029)；哈尔滨理工大学创新项目(201910214126)

详细信息

通讯作者:
陈宇飞，博士，教授，研究方向为介电复合材料、高性能航空材料结构与性能　E-mail：chenyufei@hrbust.edu.cn

中图分类号: TB332
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出版历程
- 收稿日期: 2021-02-22
- 修回日期: 2021-03-18
- 录用日期: 2021-04-11
- 网络出版日期: 2021-04-20
- 刊出日期: 2022-02-01

Microstructure and mechanical properties of MAH-GO/MBMI-E51 composites

CHEN Yufei^{1, 2
, ,},
ZHAO Hui^1
,,
TENG Chengjun³

1.
The College of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China
2.
Key Laboratory of Engineering Dielectrics and its Application, Ministry of Education, Harbin University of Science and Technology, Harbin 150080, China
3.
Harbin Xiangfang District Center for Disease Control and Prevention, Harbin 150030, China

摘要

摘要: 以少层石墨烯为原料，采用改进的Hummers法制备氧化石墨烯(GO)，再用马来酸酐(MAH)接枝改性制得MAH-GO。以4,4′-二氨基二苯甲烷型双马来酰亚胺树脂和双酚A环氧树脂(MBMI-E51)为基体、4′4-二氨基二苯甲烷(DDM)为固化剂，MAH-GO为增强体，采用原位聚合法制备MAH-GO/MBMI-E51复合材料，并表征MAH-GO的微观结构及其含量对复合材料力学性能的影响。结果表明：GO微观片层结构清晰完整，MAH通过化学键成功接枝到了GO表面，GO片层出现卷曲现象，选用化学滴定法测得接枝率约为7.26%。MAH-GO/MBMI-E51复合材料的微观形貌显示：随着增强体的增加，复合材料断面形貌由最初平直的“河流状”变为微裂纹发展延伸的“树枝状”再到密集的“韧窝状”，断裂方式实现了由脆性断裂向韧性断裂的转变。当MAH-GO添加量为1.25wt%时，复合材料的冲击强度、弯曲强度与弯曲模量分别为24.18 kJ/m²、209 MPa和14.15 GPa，比基体树脂分别提高了200%、81.7%和524%。复合材料的力学性能得到了极大的改善。
- 双酚A环氧树脂 /
- 双马来酰亚胺 /
- 马来酸酐 /
- 氧化石墨烯 /
- 微观表征 /
- 力学性能
Abstract: Graphene oxide (GO) was prepared by improved Hummers method with few layers of graphene as the raw material and then grafted with maleic anhydride (MAH) to obtain MAH-GO. The MAH-GO/MBMI-E51 compo-sites were prepared with in-situ polymerization using 4,4′-diaminodiphenylmethane bismaleimide resin and bisphenol A epoxy resin (MBMI-E51) as matrix, 4′4-diaminodiphenylmethane (DDM) as the curing agent and MAH-GO as the reinforcement. The microstructure of MAH-GO was characterized and the effect of the reinforcement on the mechanical properties of composite were studied. The results show that the MAH is successfully grafted on the surface of GO through chemical bonds by FTIR and XRD, with clear lamellar structure and curls on the surface. The grafting rate is about 7.26% with chemical titration method. The microstructure of the composites indicates that the fracture morphology of the composite material has changed from straight “river-like” to “dendritic” and then to dense “dimple”, with the addition of the reinforcement. The fracture mode has realized the transition from brittle fracture to ductile fracture. The impact strength, flexural strength and flexural modulus of the composites are 24.18 kJ/m², 209 MPa and 14.15 GPa, which are 200%, 81.7% and 524% higher than those of resin matrix, when the content of MAH-GO is 1.25wt%. The mechanical properties of the composites are greatly improved.
- bisphenol A epoxy resin /
- bismaleimide /
- maleic anhydride /
- graphene oxide /
- microstructure /
- mechanical properties

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图 1 石墨粉、GO和MAH-GO的FTIR图谱

Figure 1. FTIR spectra of graphite powder, GO and MAH-GO

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图 2 石墨粉、GO和MAH-GO的XRD图谱

Figure 2. XRD spectra of graphite powder, GO and MAH-GO

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图 3 GO (a) 和MAH-GO (b) 的SEM图像

Figure 3. SEM images of GO (a) and MAH-GO (b)

下载: 全尺寸图片幻灯片

图 4 基体和不同MAH-GO含量的MAH-GO/MBMI-E51复合材料的微观形貌SEM图像

Figure 4. SEM images of the matrix and MAH-GO/MBMI-E51 composites with different MAH-GO contents

下载: 全尺寸图片幻灯片

图 5 MAH-GO/MBMI-E51复合材料的冲击强度 (a)、弯曲强度和弯曲模量 (b)

Figure 5. Impact strength (a), flexural strength and flexural modulus (b) of MAH-GO/MBMI-E51 composites

下载: 全尺寸图片幻灯片

表 1 马来酸酐-氧化石墨烯(MAH-GO)/-4,4′-二苯甲烷型双马来酰亚胺-双酚A环氧树脂(MBMI-E51)复合材料的样品编号

Table 1. Sample number of maleic anhydride-graphene oxide (MAH-GO)/4,4′ -diaminodiphenylmethane bismaleimide-bisphenol A epoxy resin (MBMI-E51) composite

No.	Components	MAH-GO mass fraction/wt%
G0	0wt%MAH-GO/MBMI-E51	0
G1	0.25wt%MAH-GO/MBMI-E51	0.25
G2	0.50wt%MAH-GO/MBMI-E51	0.50
G3	0.75wt%MAH-GO/MBMI-E51	0.75
G4	1.0wt%MAH-GO/MBMI-E51	1.00
G5	1.25wt%MAH-GO/MBMI-E51	1.25
G6	1.5wt%MAH-GO/MBMI-E51	1.50

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