Bisphenol A type o-phthalonitrile resin modified silicoalkyne hybrid resin and its composite properties
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摘要: 采用双酚A型邻苯二甲腈预聚树脂(BAPh-P)改性聚(间二乙炔基苯-二甲基硅烷)树脂(PDMP)制备了双酚A型邻苯二甲腈/聚(间二乙炔基苯-二甲基硅烷)树脂(PBA),利用DSC、FTIR、流变分析、TGA等技术分析其固化行为、黏度以及耐热性变化。结果表明,PBA树脂固化峰值温度较PDMP升高;固化反应主要为炔基的Diels-Alder和加成反应、氰基进一步交联生成三嗪环和酞菁环等结构反应;BAPh-P的加入提升了PDMP在空气下的耐热性,PBA-1(PDMP:BAPh-P质量比为5∶1)树脂固化物在N2和空气氛围质量损失5%的温度(Td5)分别为640.6℃和591℃,1000℃质量保留率为89.0%和26.9%;随着BAPh-P质量增加,PBA树脂固化物Td5呈下降趋势,但空气中Td5均高于PDMP;石英纤维增强PBA树脂基(QF/PBA)复合材料随BAPh-P质量增加室温弯曲强度逐渐升高,高温弯曲强度先升高后降低;其中QF/PBA-2复合材料室温和400℃弯曲强度分别为363 MPa和330 MPa,较PDMP分别提升91%和214%,室温和400℃的层间剪切强度(ILSS)分别为37.5 MPa和22.2 MPa。Abstract: Bisphenol A-type phthalonitrile/poly (dimethylsilane-m-diacetylenyl phenyl) resin (PBA) was prepared by modifying Poly (dimethylsilane-m-diacetylenyl phenyl) resin (PDMP) with bisphenol A-type phthalonitrile prepolymer (BAPh-P). The curing behavior, viscosity and heat resistance were analyzed by DSC, FTIR, rheological analysis and TGA. The results show that the curing peak temperature of PBA resin is higher than that of PDMP; the curing reaction is mainly Diels alder and addition reaction of alkynyl group, triazine ring and phthalocyanine ring formed by cyano further crosslinking; heat resistance of PDMP in air is improved by the addition of BAPh-P, and temperature with mass loss of 5% (Td5) of PBA-1 (PDMP: BAPh-P mass ratio of 5∶1) in N2 and air is 640.6℃ and 591℃, respectively, and mass retention rates at 1000℃ is 89.0% and 26.9%; with the increase of BAPh-P mass, the Td5 of PBA resin curing compound decreases, but the Td5 in air is higher than that of PDMP; The bending strength of quartz fiber reinforced PBA resin matrix (QF/PBA) composites increases gradually at room temperature with the increase of BAPh-P mass, and then decreases at high temperature; flexural strength of QF/PBA-2 composite at room temperature and 400℃ is 363 MPa and 330 MPa, respectively, which is higher than that of PDMP, interlaminar shear strength (ILSS) at room temperature and 400℃ is 37.5 MPa and 22.2 MPa, respectively.
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表 1 双酚 A 型邻苯二甲腈/聚 (间二乙炔基苯-二甲基硅烷)树脂(PBA)树脂配方
Table 1. Bisphenol A-type phthalonitrile/poly (dimethylsilane-m-diacetylenyl phenyl) resin (PBA) resin formula
Sample Resin mass ratio PDMP BAPh-P PBA-1 5 1 PBA-2 5 2 PBA-3 5 3 PBA-4 5 4 PBA-5 5 5 Notes: PDMP—Poly (dimethylsilane-m-diacetylenyl phenyl) resin; BAPh-P—Bisphenol A-type phthalonitrile prepolymer. 表 2 PDMP和BAPh树脂溶解性
Table 2. Solubility of PDMP and BAPh resin
Solvent BAPh BAPh-P15 PDMP Acetone − +− − THF +− ++ ++ Toluene − +− ++ Dioxane − ++ ++ Ethyl acetate − +− − DMF ++ ++ − Notes:++—Soluble; +-—Partial soluble; −—Insoluble; BAPh-P15—BAPh-P after 4,4-diaminodiphenyl sulfone (DDS) prepoly−merization was added; THF—Tetrahydrofuran; DMF—Dimethyl formamide. 表 3 400℃固化2 h后PBA树脂固化度
Table 3. Curing degree of PBA resin after 2 h curing at 400℃
Sample Curing degree/% PBA-1 98.80 PBA-2 98.78 PBA-3 98.53 PBA-4 97.40 PBA-5 97.25 表 4 PBA树脂固化物的TGA数据
Table 4. TGA data of PBA resin curing compound
Sample Td5 /℃ Mass residue/% N2 Air N2 Air PDMP 641.1 532.0 88.9 31.6 PBA-1 640.6 591.0 89.0 26.9 PBA-2 603.3 582.7 87.7 27.7 PBA-3 586.4 571.6 87.1 19.7 PBA-4 575.5 572.2 87.0 17.4 PBA-5 569.3 571.9 85.6 17.7 Note: Td5—Temperature with mass loss of 5% 表 5 QF/PBA复合材料400℃热老化6 h质量损失
Table 5. QF/PBA composite material thermal aging at 400℃ for 6 h mass loss
Sample Mass loss/% QF/PDMP 4.80 QF/PBA-1 1.70 QF/PBA-2 1.40 QF/PBA-3 1.09 QF/PBA-4 0.70 QF/PBA-5 0.68 -
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