钨铜梯度材料热震过程中显微组织及热性能

徐仙; 陈鹏起; 台运霄; 魏邦争; 卫陈龙; 程继贵

doi:10.13801/j.cnki.fhclxb.20210215.004

钨铜梯度材料热震过程中显微组织及热性能

doi: 10.13801/j.cnki.fhclxb.20210215.004

徐仙^{1, 2, 3,},
陈鹏起^{1, 2, 3,},
台运霄^{1, 2, 3,},
魏邦争^{1, 2, 3,},
卫陈龙^{1, 2, 3,},
程继贵^{1, 2, 3, ,}

1.
合肥工业大学　材料科学与工程学院，合肥 230009
2.
安徽省粉末冶金工程中心，合肥 230009
3.
有色金属材料与加工国家地方联合工程研究中心，合肥 230009

基金项目: 国家自然科学基金(51674095；52004079)；国家重点研发计划(2018YFC1901704)

详细信息

通讯作者:
程继贵，博士，教授，博士生导师，研究方向为粉末冶金及粉体材料　 E-mail：jgcheng@hfut.edu.cn

中图分类号: TB331；TL63
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- 文章访问数: 873
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- 被引次数: 0
出版历程
- 收稿日期: 2020-12-23
- 录用日期: 2021-02-05
- 网络出版日期: 2021-02-18
- 刊出日期: 2021-12-01

Microstructure and thermal properties of W-Cu graded materials during thermal shock test

XU Xian^{1, 2, 3
,},
CHEN Pengqi^{1, 2, 3
,},
TAI Yunxiao^{1, 2, 3
,},
WEI Bangzheng^{1, 2, 3
,},
WEI Chenlong^{1, 2, 3
,},
CHENG Jigui^{1, 2, 3
, ,}

1.
School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China
2.
Research Center of Powder Metallurgy Engineering and Technology of Anhui Province, Hefei 230009, China
3.
National-Local Joint Engineering Research Center of Nonferrous Metals and Processing Technology, Hefei 230009, China

摘要

摘要: 针对目前W-Cu功能梯度材料(FGM)在长期热震循环过程中的稳定性缺乏相应研究的问题，以化学镀W-10wt%Cu复合粉体和Cu粉为原料，通过叠层压制和常压气氛烧结的工艺制备了W-10wt%Cu/W-20wt%Cu/W-30wt%Cu层状梯度材料。在600℃、800℃、1000℃温度下进行热震试验，对试样在不同热震温度、热震次数下的显微组织和热学性能变化进行了研究。试验结果表明，随着热震温度升高，渗出至试样各梯度层表面的Cu逐渐增加。当热震温度达到1000℃时，试样各梯度层表面出现大量Cu聚集成片的现象，同时在W-20wt%Cu/W-30wt%Cu界面处发现了界面裂纹。随着热震次数的提高，在W-10Cu层中，Cu逐渐渗出表面并在内部留下微孔。此外，W-Cu FGM的热导率随热震次数的增加而减小，在1000℃经过200次热震后，室温热导率由200.54 W·(m·K)⁻¹降至159.23 W·(m·K)⁻¹，降低了20.60%。该结果揭示了热震循环中裂纹形成与显微组织变化的耦合失效机制，明确了W-Cu FGM安全服役的范围。
- W-Cu合金 /
- 功能梯度材料 /
- 热震 /
- 显微组织 /
- 热导率
Abstract: In order to investigate the safe service range of W-Cu functionally graded material (FGM) in the cyclic thermal shock process, layered W-10wt%Cu/W-20wt%Cu/W-30wt%Cu gradient materials were prepared by laminated pressing and atmospheric sintering using electroless W-10wt%Cu composite powder and Cu powder as raw materials. Thermal shock experiments were carried out under temperature differences of 600℃, 800℃ and 1000℃. The microstructure and thermal properties of the sintered gradient samples were investigated under different thermal shock temperatures and times. The experimental results show that with the increase of thermal shock temperature, Cu gradually exudes to the surface of each gradient layer. When the thermal shock temperature reaches 1000℃, a large number of Cu appear in clumped sheets on the surface of each gradient layer. Simultaneously, interface cracks are found at the interface of W-20wt%Cu/W-30wt%Cu. With the increase of the number of thermal shock times, in the W-10wt%Cu layer, the Cu exudation surface leaves micro pores in the interior. In addition, the thermal conductivity of W-Cu FGM decreases with the increase of thermal shock times. After thermal shock at 1000℃ for 200 times, the thermal conductivity of room temperature drops from 200.54 W·(m·k)⁻¹ to 159.23 W·(m·k)⁻¹, decreasing by 20.60%. This result reveals the coupling failure mechanism of crack formation and microstructure changes in thermal shock cycles, and clarifies the scope of safe service of W-Cu FGM.
- W-Cu alloy /
- functionally graded material /
- thermal shock /
- microstructure /
- thermal conductivity

HTML全文

图 1 粉体的SEM图像

Figure 1. SEM images of the powder ((a) W powder; (b) W-10wt%Cu powder)

下载: 全尺寸图片幻灯片

图 2 W-Cu功能梯度材料(FGM)各梯度层表面的XRD图谱

Figure 2. XRD patterns of different layers of W-Cu functionally graded materials (FGM)

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图 3 W-Cu FGM不同区域的SEM图像

Figure 3. SEM images in different regions of the W-Cu FGM ((a) W-10wt%Cu; (b) W-20wt%Cu; (c) W-30wt%Cu)

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图 4 W-Cu FGM在不同热震温度下经过200次热震后SEM图像

Figure 4. SEM images of W-Cu FGM at different thermal shock temperatures for 200 times((a)-(c) 600℃ from W-10wt%Cu to W-30wt%Cu; (d)-(f) 800℃ from W-10wt%Cu to W-30wt%Cu; (g)- (i) 1000℃ from W-10wt%Cu to W-30wt%Cu)

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图 5 W-Cu FGM在600℃热震200次后的EDS面扫描图

Figure 5. EDS mapping of W-Cu FGM after thermal shocks at 600℃ for 200 times ((a) SEM image; (b) EDS mapping; (c) W; (d) Cu)

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图 6 W-Cu FGM在1000℃热震200次后的SEM图像

Figure 6. SEM images of W-Cu FGM after thermal shocks at 1000℃ for 200 times((a) Interface of W-10wt%Cu/W-20wt%Cu; (b) Interface of W-20wt%Cu/W-30wt%Cu)

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图 7 1000℃不同热震次数下W-10wt%Cu层截面图像

Figure 7. Cross section images of W-10wt%Cu layer at 1000℃ after different thermal shock times((a) 0 time; (b) 50 times; (c) 100 times; (d) 150 times; (e) 200 times)

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图 8 不同热震次数下W-Cu FGM试样的热导率

Figure 8. Thermal conductivity of W-Cu FGM samples after different thermal shock times

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