STUDY AND APPLICATION DEVELOPMENT OF POLYIMIDES
-
摘要: 聚酰亚胺树脂是一种耐热性高、介电性能优异、机械强度良好的高分子材料。本文中主要介绍了聚酰亚胺树脂近几年的研究与应用进展情况。包括: 用新的合成方法引入特征元素或基团, 制备出性能优异或具有某种特色功能的新型聚酰亚胺树脂; 聚酰亚胺树脂在复合材料中的应用进展; 聚酰亚胺树脂在微电子工业中的应用进展;并且提出了聚酰亚胺树脂的发展方向。Abstract: WT5,5”BZ]Polyimides have excellent thermal stability, outstanding mechanical and good dielectric performance. Recently, many new kinds of polyimides have been developed. The study and development of polyimides are summarized in this paper. Polyimides with unique properties can be achieved by introducing special structures. Carbon fiber/polyimide composites for application to aerospace possess some unique characteristics including resistance to high temperature, high specific modulus and high specific strength. Besides, the utilization of polyimides in microelectronic industry is included.
-
Key words:
- polyimide /
- composite /
- microelectronic /
- polymer matrix
点击查看大图
计量
- 文章访问数: 3323
- PDF下载量: 4671
- 被引次数: 0